Processor special features
| Intel Demand Based Switching |
Y |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
Y |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
Y |
| Intel Hyper-Threading Technology |
N |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
| CPU configuration (max) |
1 |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
42927 |
| Intel Virtualization Technology (VT-x) |
Y |
| Intel® Turbo Boost Technology |
Y |
| Intel Trusted Execution Technology |
Y |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
Processor
| ECC supported by processor |
Y |
| Tcase |
72.7 °C |
| Maximum internal memory supported by processor |
32 GB |
| Processor frequency |
2.4 GHz |
| Stepping |
B1 |
| Processor operating modes |
64-bit |
| Embedded options available |
Y |
| FSB Parity |
N |
| Number of Processing Die Transistors |
774 M |
| PCI Express configurations |
4x4, 2x8, 1x16 |
| Conflict Free processor |
N |
| Memory channels supported by processor |
Dual |
| Memory bandwidth supported by processor (max) |
21 GB/s |
| Memory clock speeds supported by processor |
1333, 1066, 800 MHz |
| Processor cache type |
Smart Cache |
| Processor code |
SLBLJ |
| Physical Address Extension (PAE) |
36 bit |
| Maximum number of PCI Express lanes |
1 |
| Processor boost frequency |
2.8 GHz |
| Processor cache |
8 MB |
| Number of processors installed |
1 |
| Processor cores |
4 |
| Maximum number of SMP processors |
1 |
| Thermal Design Power (TDP) |
95 W |
| CPU multiplier (bus/core ratio) |
18 |
| Processor lithography |
45 nm |
| Processor package size |
37.5 mm |
| Thermal Monitoring Technologies |
N |
| Idle States |
Y |
| Execute Disable Bit |
Y |
| Bus type |
DMI |
| Memory types supported by processor |
DDR3-SDRAM |
| Supported instruction sets |
SSE4.2 |
Expansion slots
| PCI Express slots version |
2.0 |
| PCI Express x4 slots |
1 |
| PCI Express x8 slots |
2 |
Storage
| Maximum storage capacity |
2 TB |
| Hot-swap |
Y |
Other features
| Hot-swap hard drive bays |
2x 3.5" SAS/SATA / 4x 2.5" SAS |
| Mac compatibility |
N |
| DVD |
SATA |
Memory
| Maximum internal memory |
32 GB |
| Internal memory |
4 GB |
| Internal memory type |
DDR3-SDRAM |
Graphics
| Maximum graphics adapter memory |
16 MB |
Design
| Chassis type |
Rack (1U) |
| Optical drive type |
DVD-ROM |
Ports & interfaces
| Serial ports quantity |
1 |
| VGA (D-Sub) ports quantity |
1 |
Networking
| Networking features |
Gigabit Ethernet |
Additionally
| System bus data transfer rate |
2.5 GT/s |
| Graphics |
G200 |
| Processing die size |
296 mm² |
| InTru™ 3D Technology |
N |
| Ethernet LAN (RJ-45) ports quantity |
2 |
| Intel AES New Instructions |
N |
System x3250 M3, Rack 1U, Intel Xeon X3430 (2.40GHz, 8MB, 2.5GT/s), 4GB (2x 2048MB) PC3-10600 DDR3 SDRAM
Highlights
-Maximise performance with the latest Intel® technology in a robust, flexible platform.
-Achieve energy savings with built-in power management tools.
-Minimise risks with trouble-free serviceability and maintenance.
The IBM System x3250 M3 is a single-socket server that offers new levels of performance and flexibility to help you respond quickly to changing business demands. Cost-effective and compact, it is well-suited for small to mid-sized businesses (SMBs) as well as large enterprises, whether for general-purpose workloads or specialised applications.
Amplify your performance
Built with the latest Intel Xeon® 3400 Series or Celeron®, Pentium® or Core i3 dual-core processors, the x3250 M3 has industry-leading computing capabilities in a small, 1U footprint. It also offers substantial memory and storage capacity to help you manage your data efficiently.
Product features
-Innovative technology provides the latest processors and vast memory in a compact 1U footprint.
-Power-efficient design helps save on energy costs.
-Affordable price point and total cost of ownership (TCO).
-Integrated tools support easy deployment and management.
-IBM tested and certified for quality and reliability.
-Rich security features to meet today’s security requirements.
Hardware summary
-22" depth, 1U form factor.
-Choice of processors – Intel® Xeon 3400 Series quad-core or Intel Celeron, Pentium or Core i3 dual-core.
-Double Data Rate (DDR)-3 Error Checking and Correction (ECC) memory, up to 1333 MHz; 1 GB, 2 GB and 4 GB Unregistered Dual Inline Memory Modules (UDIMMs), 16 GB UDIMM max; 1 GB, 2 GB, 4 GB and 8 GB Registered Dual Inline Memory Modules (RDIMMs); 32 GB RDIMM max.
-Two 3.5" simple-swap Serial Advanced Technology Attachment (SATA) or 3.5" hot-swap Serial Attached SCSI (SAS)/SATA or four 2.5" hot-swap SAS hard disk drives (HDDs).
