Processor special features
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
Y |
| Intel Hyper-Threading Technology |
Y |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel® Smart Cache |
Y |
| Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
| CPU configuration (max) |
1 |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
42929 |
| Intel Virtualization Technology (VT-x) |
Y |
| Intel Trusted Execution Technology |
Y |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Turbo Boost Technology |
Y |
| Intel® Wireless Display (Intel® WiDi) |
N |
| Intel Demand Based Switching |
Y |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
Y |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
Processor
| Maximum internal memory supported by processor |
32 GB |
| Processor frequency |
2.66 GHz |
| Stepping |
B1 |
| Processor operating modes |
64-bit |
| Embedded options available |
Y |
| FSB Parity |
N |
| Number of Processing Die Transistors |
774 M |
| PCI Express configurations |
4x4, 2x8, 1x16 |
| Conflict Free processor |
N |
| Physical Address Extension (PAE) |
Y |
| Memory channels supported by processor |
Dual |
| Memory bandwidth supported by processor (max) |
21 GB/s |
| Memory clock speeds supported by processor |
1333, 1066, 800 MHz |
| Processor cache type |
Smart Cache |
| Processor code |
SLBLD |
| Physical Address Extension (PAE) |
36 bit |
| Maximum number of PCI Express lanes |
1 |
| Thermal Monitoring Technologies |
N |
| Idle States |
Y |
| Execute Disable Bit |
Y |
| Processor boost frequency |
3.2 GHz |
| Processor cache |
8 MB |
| Number of processors installed |
1 |
| Processor cores |
4 |
| Maximum number of SMP processors |
1 |
| Thermal Design Power (TDP) |
95 W |
| CPU multiplier (bus/core ratio) |
20 |
| Processor lithography |
45 nm |
| Processor package size |
37.5 mm |
| ECC supported by processor |
Y |
| Tcase |
72.7 °C |
| Bus type |
DMI |
| Memory types supported by processor |
DDR3-SDRAM |
| Supported instruction sets |
SSE4.2 |
Expansion slots
| PCI Express slots version |
2.0 |
| PCI Express x4 slots |
1 |
| PCI Express x8 slots |
1 |
Storage
| RAID support |
Y |
| Total storage capacity |
2000 GB |
| Number of hard drives installed |
1 |
| Hot-swap |
Y |
| Hard drive size |
3.5 " |
Memory
| Maximum internal memory |
24 GB |
| Memory slots |
6x DIMM |
| Internal memory |
2 GB |
| Memory clock speed |
1333 MHz |
| Internal memory type |
DDR3-SDRAM |
Power
| Number of power supply units |
1 |
| Power supply |
351 W |
Graphics
| Maximum graphics adapter memory |
16 MB |
Ports & interfaces
| Serial ports quantity |
1 |
| VGA (D-Sub) ports quantity |
1 |
Networking
| Networking features |
Gigabit Ethernet |
Certificates
| Compliance industry standards |
IEEE 802.3, IEEE 802.3u, IEEE 802.3ab |
Additionally
| Ethernet LAN connection |
Y |
| System bus data transfer rate |
2.5 GT/s |
| Graphics |
ES1000 |
| Processing die size |
296 mm² |
| InTru™ 3D Technology |
N |
| Intel AES New Instructions |
N |
| Ethernet LAN (RJ-45) ports quantity |
2 |
System x3250 M3, Intel Xeon X3450 4C 2.67 GHz/8 MB L2, 2 GB DDR3, ATI ES1000 RN50, 4 TB 3.5" SAS, 1U Rack black
Highlights
- Maximize performance with the latest Intel® technology in a robust, flexible platform;
- Achieve energy savings with built-in power management tools;
- Minimize risks with trouble-free serviceability and maintenance.
The IBM® System x3250 M3 is a single-socket server that offers new levels of performance and flexibility to help you respond quickly to changing business demands. Cost-effective and compact, it is well-suited for small to midsized businesses as well as large enterprises, whether for general-purpose workloads or specialized applications.
Amplify your performance
Built with the latest Intel® Xeon® 3400 Series or Celeron®, Pentium® or Core™ i3 dual-core processors, the x3250 M3 has industry-leading computing capabilities in a small, 1U footprint. It also offers substantial memory and storage capacity to help you manage your data efficiently.
Product features
- Innovative technology provides the latest processors and vast memory in a compact 1U footprint;
- Power-efficient design helps save on energy costs;
- Affordable price point and total cost of ownership;
- Integrated tools support easy deployment and management;
- IBM tested and certified for quality and reliability;
- Rich security features to meet today’s security requirements.
Hardware summary
- 22" depth, 1U form factor;
- Choice of processors-Intel® Xeon® 3400 Series quad-core or Intel® Celeron®, Pentium® or Core™ i3 dual-core;
- DDR-3 ECC memory, up to 1333 MHz; 1 GB, 2 GB and 4 GB UDIMMs, 16 GB UDIMM max; 1 GB, 2 GB, 4 GB and 8 GB RDIMMs; 32 GB RDIMM max;
- Two 3.5" simple-swap SATA or 3.5" hot-swap SAS/SATA or four 2.5" hot-swap SAS HDDs.
