Processor special features
Enhanced Intel SpeedStep Technology |
Y |
Intel FDI Technology |
N |
Intel VT-x with Extended Page Tables (EPT) |
Y |
Intel vPro Technology |
N |
Intel Clear Video Technology for MID |
N |
Intel® My WiFi Technology (Intel® MWT) |
N |
Intel Enhanced Halt State |
Y |
Intel Hyper-Threading Technology |
N |
Intel® Anti-Theft Technology (Intel® AT) |
N |
Intel Virtualization Technology for Directed I/O (VT-d) |
N |
Intel Dual Display Capable Technology |
N |
Intel Clear Video Technology |
N |
Intel 64 |
Y |
Intel® Insider™ |
N |
Intel® Quick Sync Video Technology |
N |
Processor ARK ID |
33093 |
Intel Virtualization Technology (VT-x) |
Y |
Intel Trusted Execution Technology |
N |
Intel Flex Memory Access |
N |
Intel Fast Memory Access |
N |
Intel Rapid Storage Technology |
N |
Intel® Turbo Boost Technology |
N |
Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
Intel® Wireless Display (Intel® WiDi) |
N |
Intel Demand Based Switching |
Y |
Storage
Hard drive interface |
Serial ATA |
Maximum storage capacity |
3 TB |
Hot-swap |
N |
Processor
Processor frequency |
1.86 GHz |
Stepping |
E0 |
Processor operating modes |
64-bit |
Embedded options available |
N |
FSB Parity |
N |
Number of Processing Die Transistors |
410 M |
Processor front side bus |
1066 MHz |
Conflict Free processor |
N |
Processor cache type |
L2 |
Processor codename |
Wolfdale |
Thermal Monitoring Technologies |
N |
Idle States |
Y |
Execute Disable Bit |
Y |
Processor cache |
6 MB |
Number of processors installed |
1 |
Processor cores |
2 |
Maximum number of SMP processors |
2 |
Thermal Design Power (TDP) |
65 W |
CPU multiplier (bus/core ratio) |
7 |
Processor lithography |
45 nm |
Processor package size |
37.5 mm |
Bus type |
FSB |
ECC supported by processor |
N |
Tcase |
66 °C |
Ports & interfaces
PS/2 ports quantity |
2 |
Parallel ports quantity |
1 |
Serial ports quantity |
2 |
VGA (D-Sub) ports quantity |
1 |
Memory
Maximum internal memory |
32 GB |
Memory slots |
8 |
Internal memory |
1 GB |
Memory clock speed |
667 MHz |
Internal memory type |
DDR2-SDRAM |
Graphics
Maximum graphics adapter memory |
16 MB |
Design
Chassis type |
Tower |
Optical drive type |
DVD-ROM |
Networking
Networking features |
Gigabit Ethernet |
Additionally
Graphics |
RN50 |
Processing die size |
107 mm² |
InTru™ 3D Technology |
N |
Intel AES New Instructions |
N |
Ethernet LAN (RJ-45) ports quantity |
3 |
System x3400, Intel Xeon E5205, 1024MB DDR2 RAM, SATA, DVD-ROM, Tower
Ideal for growing businesses
The IBM System x3400 is an excellent low-cost solution for growing businesses or branch offices that rely on 24x7 availability and mission-critical applications. Optional features let you configure a server customized for your needs—from basic file-and-print to a robust, mission-critical application server—saving you time and money.
Flexibility for your investment
For small organizations with big plans, the x3400 can grow with you. Deploy an infrastructure with less hardware, that supports the same—or more—applications. Start with a basic configuration and add features and capacity to accommodate your growing business.
For branch offices with demanding, complex data transactions, the x3400 offers dual-socket computing power and support for up to eight-core processor performance, making the x3400 an affordable yet robust system. Optional redundant features help maintain business-critical availability and uptime.
Select configurations of the x3400 are part of the IBM Express Advantage Portfolio™ designed to meet the needs of mid-sized businesses. Easy to manage, Express models/configurations vary by country.
Product features
- Flexibility to use either high-performance SAS or low-cost SATA hard disk drives;
- Dual-socket computing power optimized for up to eight cores at lower power usage per core;
- Provides high availability with optional hot-swap redundant cooling, power and hard disk drives;
- Get more robust systems management with the Integrated Systems Management Processor;
- Calibrated Vectored Cooling™ helps prolong system life by helping keep internal components cool.