Processor special features
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
N |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
Y |
| Intel Hyper-Threading Technology |
N |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
N |
| Intel Dual Display Capable Technology |
N |
| Intel® Turbo Boost Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
27217 |
| Intel Trusted Execution Technology |
N |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
| Intel Demand Based Switching |
N |
| Enhanced Intel SpeedStep Technology |
Y |
Processor
| Processor frequency |
2.33 GHz |
| Processor system type |
DP |
| Processor operating modes |
64-bit |
| Embedded options available |
Y |
| FSB Parity |
Y |
| Number of Processing Die Transistors |
291 M |
| CPU multiplier (bus/core ratio) |
7 |
| Processor front side bus |
1333 MHz |
| Conflict Free processor |
N |
| Processor cache type |
L2 |
| Number of processors installed |
1 |
| Processor cores |
2 |
| Maximum number of SMP processors |
2 |
| Thermal Design Power (TDP) |
65 W |
| Processor lithography |
65 nm |
| Processor package size |
37.5 mm |
| Thermal Monitoring Technologies |
Y |
| Execute Disable Bit |
Y |
| Processor cache |
4 MB |
| Bus type |
FSB |
| ECC supported by processor |
N |
| Tcase |
65 °C |
Storage
| Total storage capacity |
2400 GB |
Ports & interfaces
| PS/2 ports quantity |
2 |
| Serial ports quantity |
2 |
| Parallel ports quantity |
1 |
| VGA (D-Sub) ports quantity |
1 |
Memory
| Maximum internal memory |
48 GB |
| Memory slots |
12x DIMM |
| Internal memory |
1 GB |
| Internal memory type |
DDR2-SDRAM |
| ECC |
Y |
Other features
| DVD read speed |
16 x |
| DVD interface type |
EIDE |
| Hard disk controller |
SATA/SAS |
Design
| Chassis type |
Tower (5U) |
| Optical drive type |
DVD-ROM |
Graphics
| Maximum graphics adapter memory |
16 MB |
Networking
| Networking features |
Gigabit Ethernet |
Additionally
| Graphics |
RN50 |
| Processing die size |
143 mm² |
| InTru™ 3D Technology |
N |
| Ethernet LAN (RJ-45) ports quantity |
3 |
| Intel AES New Instructions |
N |
System x3500, 1x Dual Core Xeon 2.33 GHz/1333 MHz (2 x 2 MB L2), 2x 512 MB PC2-5300 ECC DDR2 AMF SDRAM, 0 GB SAS HD (open bay), DVD-ROM, 2x Broadcom 5721 Gigabit Ethernet, ATI RN50 (16 MB), 1x 835 W
Optimized for business advantage
The IBM System x3500 delivers unprecedented performance and reliability for demanding distributed environments that rely on 24x7 availability of mission-critical applications. With up to four-core processor performance at lower power consumption per core, the x3500 offers leading-edge capacity and high-speed I/O scalability. A long-life platform with 24-month availability, the x3500 minimizes deployment and support concerns.
