Intel Enhanced Halt State | Y |
---|---|
Intel Hyper-Threading Technology | N |
Intel® Anti-Theft Technology (Intel® AT) | N |
Intel Virtualization Technology for Directed I/O (VT-d) | N |
Intel Dual Display Capable Technology | N |
Intel Clear Video Technology | N |
Intel 64 | Y |
Intel® Insider™ | N |
Intel® Quick Sync Video Technology | N |
Processor ARK ID | 33081 |
Intel Virtualization Technology (VT-x) | Y |
Intel Trusted Execution Technology | N |
Intel® Turbo Boost Technology | N |
Intel Flex Memory Access | N |
Intel Fast Memory Access | N |
Intel Rapid Storage Technology | N |
Intel® Clear Video HD Technology (Intel® CVT HD) | N |
Intel® Wireless Display (Intel® WiDi) | N |
Intel Demand Based Switching | Y |
Enhanced Intel SpeedStep Technology | Y |
Intel FDI Technology | N |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel vPro Technology | N |
Intel Clear Video Technology for MID | N |
Intel® My WiFi Technology (Intel® MWT) | N |
Processor operating modes | 64-bit |
---|---|
Embedded options available | N |
FSB Parity | Y |
Number of Processing Die Transistors | 820 M |
Processor front side bus | 1333 MHz |
Conflict Free processor | N |
CPU multiplier (bus/core ratio) | 8 |
Processor cache type | L2 |
Processor code | SLBBK |
Thermal Monitoring Technologies | Y |
Idle States | Y |
Processor cores | 4 |
Thermal Design Power (TDP) | 80 W |
Processor package size | 37.5 mm |
Execute Disable Bit | Y |
Processor cache | 12 MB |
Number of processors installed | 1 |
Maximum number of SMP processors | 2 |
Processor lithography | 45 nm |
Bus type | FSB |
ECC supported by processor | N |
Tcase | 67 °C |
Processor frequency | 2.66 GHz |
Stepping | E0 |
Processor system type | DP |
ECC | Y |
---|---|
Internal memory | 2 GB |
Internal memory type | DDR2-SDRAM |
Maximum internal memory | 32 GB |
Memory slots | 8 DIMM |
Chassis type | Rack (1U) |
---|
Maximum graphics adapter memory | 16 MB |
---|
VGA (D-Sub) ports quantity | 1 |
---|
Power supply | 670 W |
---|
Networking features | Gigabit Ethernet |
---|
Total storage capacity | 600 GB |
---|
Processing die size | 214 mm² |
---|---|
InTru™ 3D Technology | N |
Intel AES New Instructions | N |
Graphics | RN50 |
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