Storage
| Total storage capacity |
4000 GB |
| Number of hard drives installed |
1 |
| Hot-swap |
Y |
| Hard drive size |
2.5 " |
| RAID support |
Y |
| Maximum storage capacity |
4 TB |
Memory
| Maximum internal memory |
144 GB |
| Memory slots |
18x DIMM |
| Internal memory type |
DDR3-SDRAM |
| Memory clock speed |
1333 MHz |
| Internal memory |
4 GB |
Processor special features
| Intel Enhanced Halt State |
Y |
| Intel Hyper-Threading Technology |
N |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel® Smart Cache |
Y |
| Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel® Turbo Boost Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
37100 |
| Intel Virtualization Technology (VT-x) |
Y |
| Intel Trusted Execution Technology |
N |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
| Intel Demand Based Switching |
Y |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
Y |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
Processor
| Processor operating modes |
64-bit |
| Embedded options available |
N |
| FSB Parity |
N |
| Conflict Free processor |
N |
| Physical Address Extension (PAE) |
Y |
| Memory channels supported by processor |
Triple |
| Memory bandwidth supported by processor (max) |
19.2 GB/s |
| Memory clock speeds supported by processor |
800 MHz |
| Processor cache type |
Smart Cache |
| Processor code |
SLBKC |
| Processor cores |
4 |
| Physical Address Extension (PAE) |
40 bit |
| Thermal Monitoring Technologies |
N |
| Idle States |
Y |
| Execute Disable Bit |
Y |
| Number of QPI links |
2 |
| Processor cache |
4 MB |
| Number of processors installed |
1 |
| Maximum number of SMP processors |
2 |
| Thermal Design Power (TDP) |
80 W |
| Processor lithography |
45 nm |
| Bus type |
QPI |
| Memory types supported by processor |
DDR3-SDRAM |
| ECC supported by processor |
Y |
| Tcase |
76 °C |
| Maximum internal memory supported by processor |
144 GB |
| Processor frequency |
2.26 GHz |
| Stepping |
D0 |
Power
| Number of power supply units |
1 |
| Power supply |
675 W |
Graphics
| Maximum graphics adapter memory |
16 MB |
Networking
| Networking features |
Gigabit Ethernet |
Additionally
| InTru™ 3D Technology |
N |
| Ethernet LAN (RJ-45) ports quantity |
2 |
| Intel AES New Instructions |
N |
| Ethernet LAN connection |
Y |
| System bus data transfer rate |
4.8 GT/s |
| Graphics |
G200eV |
System x3550 M3, Intel Xeon E5507 4C/2.26 GHz, 4GB DDR3, 4TB 2.5" SAS, Matrox G200eV, 1U Rack, black
Series features:
- 1U chassis;
- Up to two 3.33 GHz six-core (2.96 GHz four-core) Intel Xeon 5600 series processors with QuickPath Interconnect technology, up to 1333 MHz memory access speed;
- Low 675 W design and up to 92% efficient power supplies, six cooling fan modules, new UEFI BIOS, altimeter monitored by Integrated Management Module and IBM Systems Director Active Energy Manager;
- Up to 192 GB RDIMMs1 or 48 GB UDIMMs1 high-performance, new generation DDR-3 memory;
- Internal storage flexibility with up to 8 2.5" hot-swap SAS/SATA HDDs or SSDs;
- Up to 2 PCIe slots;
- VMware ESXi 4.0 embedded hypervisor support with optional 2 GB USB key for virtualization.
Maximum RDIMM support for 192 GB when 16 GB DIMMs are available in 2Q 2010, and maximum UDIMM support for 48 GB when 4 GB DIMMs are available in 2Q 2010.
