Processor special features
| Intel Demand Based Switching |
Y |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
Y |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
Y |
| Intel Hyper-Threading Technology |
N |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
N |
| Intel® Turbo Boost Technology |
N |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
35430 |
| Intel Virtualization Technology (VT-x) |
Y |
| Intel Trusted Execution Technology |
N |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
Processor
| ECC supported by processor |
N |
| Tcase |
63 °C |
| Processor frequency |
3.33 GHz |
| Stepping |
E0 |
| Processor cores |
4 |
| Processor system type |
DP |
| Processor operating modes |
64-bit |
| CPU multiplier (bus/core ratio) |
10 |
| Embedded options available |
N |
| FSB Parity |
Y |
| Number of Processing Die Transistors |
820 M |
| Processor front side bus |
1333 MHz |
| Conflict Free processor |
N |
| Processor cache type |
L2 |
| Processor code |
SLBBF |
| Thermal Monitoring Technologies |
Y |
| Idle States |
Y |
| Execute Disable Bit |
Y |
| Thermal Design Power (TDP) |
120 W |
| Processor cache |
12 MB |
| Number of processors installed |
1 |
| Maximum number of SMP processors |
2 |
| Processor lithography |
45 nm |
| Bus type |
FSB |
Storage
| Hard drive interface |
Serial Attached SCSI (SAS) |
| Hot-swap |
Y |
| Hard drive size |
3.5 " |
Memory
| Maximum internal memory |
48 GB |
| Internal memory |
2 GB |
| Memory slots |
12x DIMM |
| Internal memory type |
DDR2-SDRAM |
| Memory clock speed |
667 MHz |
| ECC |
Y |
Design
| Optical drive type |
DVD-ROM |
| Chassis type |
Rack (2U) |
Graphics
| Maximum graphics adapter memory |
16 MB |
Ports & interfaces
| Serial ports quantity |
1 |
| VGA (D-Sub) ports quantity |
2 |
Networking
| Networking features |
Gigabit Ethernet |
Additionally
| Graphics |
RN50 |
| Processing die size |
214 mm² |
| InTru™ 3D Technology |
N |
| Ethernet LAN (RJ-45) ports quantity |
2 |
| Intel AES New Instructions |
N |
1x Quad-Core Intel Xeon Processor X5470 3.33GHz / 133 MHz FSB 120W (12MB L2), 2 x 1GB 667MHz DDR2 AMF PC2-5300 SDRAM ECC DIMM Memory, 0x 0GB 3.5" SAS hot-swap HD (open bay), 1x CD-R/CD-RW DVD Combo drive (8x-24x), 2x Broadcom Gigabit Ethernet planar (10/100/1000 Mbps), ATI RN50 (16MB), 1x 835W
New levels of speed and performance
For constrained data centre environments, the IBM System x3650 offers unprecedented performance and reliability. Optimised for up to four-core processor performance, the x3650 delivers rack-dense, dual-core computing power, an impressive 12 DIMM memory design and super-efficient network communication.
Protect your IT investment
Scalable memory and I/O design satisfy high-speed processing and reliability requirements, while integrated RAID safeguards data. Hot-swap power and cooling with Calibrated Vectored Cooling and IBM PowerExecutive help keep your server cool. The result? Run two different workloads on a two-socket server – without running out of IT funds.
