Processor special features
| Intel VT-x with Extended Page Tables (EPT) |
Y |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
Y |
| Intel Hyper-Threading Technology |
N |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
N |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
27219 |
| Intel Virtualization Technology (VT-x) |
Y |
| Intel Trusted Execution Technology |
N |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Turbo Boost Technology |
N |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
| Intel Demand Based Switching |
N |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
Storage
| Hard drive interface |
Serial Attached SCSI (SAS) |
| Number of hard drives installed |
2 |
| Hard drive capacity |
73 GB |
Processor
| Processor frequency |
3 GHz |
| Processor cores |
2 |
| Processor operating modes |
64-bit |
| Embedded options available |
N |
| FSB Parity |
Y |
| Number of Processing Die Transistors |
291 M |
| Processor front side bus |
1333 MHz |
| Conflict Free processor |
N |
| Physical Address Extension (PAE) |
Y |
| Processor cache type |
L2 |
| Physical Address Extension (PAE) |
32 bit |
| Thermal Monitoring Technologies |
Y |
| Idle States |
Y |
| Thermal Design Power (TDP) |
80 W |
| Processor package size |
37.5 mm |
| Execute Disable Bit |
Y |
| Processor cache |
4 MB |
| Number of processors installed |
1 |
| Maximum number of SMP processors |
2 |
| CPU multiplier (bus/core ratio) |
9 |
| Processor lithography |
65 nm |
| Bus type |
FSB |
| ECC supported by processor |
N |
| Tcase |
65 °C |
Memory
| Maximum internal memory |
48 GB |
| Internal memory |
2 GB |
| Memory slots |
12x DIMM |
| ECC |
Y |
| Internal memory type |
DDR2-SDRAM |
Design
| Optical drive type |
DVD-ROM |
| Chassis type |
Rack (2U) |
Power
| Number of power supply units |
2 |
| Power supply |
835 W |
Graphics
| Maximum graphics adapter memory |
16 MB |
Ports & interfaces
| Serial ports quantity |
1 |
| VGA (D-Sub) ports quantity |
2 |
Networking
| Networking features |
Gigabit Ethernet |
Additionally
| Graphics |
RN50 |
| Processing die size |
143 mm² |
| InTru™ 3D Technology |
N |
| Ethernet LAN (RJ-45) ports quantity |
2 |
| Intel AES New Instructions |
N |
System x3650, 1x Dual-core Xeon 5160 3 GHz (4 MB L2 cache), 2x 1 GB PC2-5300 CL5 ECC DDR2 Chipkill FBDIMM, 2x 73 GB hot-swap SAS HD, CD-RW/DVD-ROM, 1x Dual Port Server Adapter, 2x Broadcom Gigabit Ethernet, ATI RN50 (16 MB), 2x 835 W
New levels of speed and performance
For constrained data centre environments, the IBM System x3650 offers unprecedented performance and reliability. Optimised for up to four-core processor performance, the x3650 delivers rack-dense, dual-core computing power, an impressive 12 DIMM memory design and super-efficient network communication.
Protect your IT investment
Scalable memory and I/O design satisfy high-speed processing and reliability requirements, while integrated RAID safeguards data. Hot-swap power and cooling with Calibrated Vectored Cooling and IBM PowerExecutive help keep your server cool. The result? Run two different workloads on a two-socket server – without running out of IT funds.
