Processor special features
Intel Enhanced Halt State |
Y |
Intel Hyper-Threading Technology |
Y |
Intel® Anti-Theft Technology (Intel® AT) |
N |
Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
Intel® Turbo Boost Technology |
Y |
CPU configuration (max) |
2 |
Intel Dual Display Capable Technology |
N |
Intel Clear Video Technology |
N |
Intel 64 |
Y |
Intel® Insider™ |
N |
Intel® Quick Sync Video Technology |
N |
Processor ARK ID |
37111 |
Intel Trusted Execution Technology |
N |
Intel Flex Memory Access |
N |
Intel Fast Memory Access |
N |
Intel Rapid Storage Technology |
N |
Intel® My WiFi Technology (Intel® MWT) |
N |
Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
Intel® Wireless Display (Intel® WiDi) |
N |
Intel Demand Based Switching |
Y |
Enhanced Intel SpeedStep Technology |
Y |
Intel FDI Technology |
N |
Intel VT-x with Extended Page Tables (EPT) |
Y |
Intel vPro Technology |
N |
Intel Clear Video Technology for MID |
N |
Processor
Processor operating modes |
64-bit |
Embedded options available |
N |
FSB Parity |
N |
CPU multiplier (bus/core ratio) |
22 |
Number of Processing Die Transistors |
731 M |
Conflict Free processor |
N |
Memory bandwidth supported by processor (max) |
32 GB/s |
Processor cache type |
Smart Cache |
Processor code |
SLBF3 |
Physical Address Extension (PAE) |
40 bit |
Thermal Monitoring Technologies |
N |
Execute Disable Bit |
Y |
Processor cache |
8 MB |
Thermal Design Power (TDP) |
95 W |
Number of QPI links |
2 |
Processor boost frequency |
3.33 GHz |
Number of processors installed |
1 |
Processor cores |
4 |
Maximum number of SMP processors |
2 |
Processor lithography |
45 nm |
Processor package size |
42.5 mm |
Stepping |
D0 |
Processor system type |
DP |
Bus type |
QPI |
ECC supported by processor |
Y |
Tcase |
75 °C |
Maximum internal memory supported by processor |
144 GB |
Processor frequency |
2.93 GHz |
Other features
Disk array controller |
MR10i |
Mac compatibility |
N |
Storage
Hot-swap |
Y |
Hard drive size |
2.5 " |
Maximum storage capacity |
3.6 TB |
Hard drive interface |
Serial Attached SCSI (SAS) |
Power
Number of power supply units |
2 |
Power supply |
675 W |
Memory
ECC |
Y |
Internal memory type |
DDR3-SDRAM |
Maximum internal memory |
128 GB |
Memory slots |
16 DIMM |
Internal memory |
12 GB |
Design
Optical drive type |
DVD Super Multi |
Chassis type |
Rack (2U) |
Ports & interfaces
VGA (D-Sub) ports quantity |
3 |
Networking
Networking features |
Gigabit Ethernet |
Additionally
Processing die size |
263 mm² |
InTru™ 3D Technology |
N |
Intel AES New Instructions |
N |
System bus data transfer rate |
6.4 GT/s |
Ethernet LAN (RJ-45) ports quantity |
4 |
System x3650 M2, Xeon X5570, 2.93GHz, 8MB L2, 3x4GB, O/B, MR10i, 2x PS, rack 2U
-Reduce cost with an energy-smart design that provides optimal computing performance per watt.
-Improve service with a flexible design that is easy to deploy, integrate and manage.
-Manage risk with resilient architectures and virtualized environments.
Energy-efficient profile
The IBM® System x3650 M2 offers robust, proven technology and a flexible, energy-smart design. Delivering quad-core computing on Intel® Xeon® 5500 Series processors with QuickPath Interconnect technology, this powerful 2U server delivers significant performance improvement per watt compared to previous generation servers by integrating low-wattage components for an energy-smart thermal profile.
Designed for virtualization
Designed to provide leadership virtualization, the x3650 M2 supports the VMware ESXi 3.5 embedded hypervisor, the industry-leading solution for virtualization. In addition, the x3650 M2 provides exceptional memory per core, enabling you to implement virtualization efficiently and cost-effectively.
Select configurations of the x3650 M2 are part of the IBM Express Advantage™ Portfolio, designed to meet the needs of midsized businesses. Easy to manage, Express™ models/configurations vary by country.