Processor special features
| Intel Demand Based Switching |
Y |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
Y |
| Intel vPro Technology |
N |
| Processor ARK ID |
37111 |
| Intel Trusted Execution Technology |
N |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Turbo Boost Technology |
Y |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
Y |
| Intel Hyper-Threading Technology |
Y |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
| CPU configuration (max) |
2 |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
Processor
| ECC supported by processor |
Y |
| Tcase |
75 °C |
| Maximum internal memory supported by processor |
144 GB |
| Processor frequency |
2.93 GHz |
| Processor cache type |
Smart Cache |
| Processor code |
SLBF3 |
| Physical Address Extension (PAE) |
40 bit |
| Thermal Monitoring Technologies |
N |
| Execute Disable Bit |
Y |
| Number of QPI links |
2 |
| Processor cache |
8 MB |
| Processor boost frequency |
3.33 GHz |
| Number of processors installed |
1 |
| Processor cores |
4 |
| Maximum number of SMP processors |
2 |
| Thermal Design Power (TDP) |
95 W |
| CPU multiplier (bus/core ratio) |
22 |
| Processor lithography |
45 nm |
| Processor package size |
42.5 mm |
| Stepping |
D0 |
| Processor system type |
DP |
| Processor operating modes |
64-bit |
| Embedded options available |
N |
| FSB Parity |
N |
| Number of Processing Die Transistors |
731 M |
| Conflict Free processor |
N |
| Memory bandwidth supported by processor (max) |
32 GB/s |
| Bus type |
QPI |
Memory
| Memory clock speed |
1333 MHz |
| ECC |
Y |
| Internal memory |
2 GB |
| Internal memory type |
DDR3-SDRAM |
| Maximum internal memory |
128 GB |
| Memory slots |
16 |
Graphics
| Maximum graphics adapter memory |
16 MB |
Design
| Chassis type |
Rack (2U) |
| Optical drive type |
DVD-ROM |
Ports & interfaces
| Serial ports quantity |
1 |
| VGA (D-Sub) ports quantity |
2 |
Storage
| Maximum storage capacity |
2.4 TB |
| Hot-swap |
Y |
Networking
| Networking features |
Gigabit Ethernet |
Additionally
| System bus data transfer rate |
6.4 GT/s |
| Graphics |
G200eV |
| Ethernet LAN (RJ-45) ports quantity |
2 |
| Processing die size |
263 mm² |
| InTru™ 3D Technology |
N |
| Intel AES New Instructions |
N |
System x3650 M2, Intel Xeon X5570, 2GB DDR3 RAM, SAS/SATA, CD-RW/DVD-ROM Combo, Rack 2U
Energy-efficient profile
The IBM System x3650 M2 offers robust and proven technology and a flexible, energy-smart design. Delivering quad-core computing on Intel® Xeon® 5500 Series processors with QuickPath Interconnect technology, this powerful 2U server delivers significant performance improvement per watt compared to previous generation servers by integrating low-wattage components for an energy-smart thermal profile.
Designed for virtualization
Designed to provide leadership virtualization, the x3650 M2 supports the VMware ESXi 3.5 embedded hypervisor, the industry-leading solution for virtualization. In addition, the x3650 M2 provides exceptional memory per core, enabling you to implement virtualization efficiently and cost-effectively.
Select configurations of the x3650 M2 are part of the IBM Express Advantage™ Portfolio, designed to meet the needs of midsized businesses. Easy to manage, Express™ models/configurations vary by country.
Product features
- Outstanding power-optimized performance that can double compute capability of previous generation 2-socket servers;
- Helps lower operational costs with innovative energy-smart 2U design;
- Improve service with a highly scalable, flexible design that is easy to deploy, integrate, service and manage;
- Manage risk with resilient architectures and virtualized environments.
