Processor special features
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
Y |
| Intel Hyper-Threading Technology |
Y |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
N |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Turbo Boost Technology |
N |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
27282 |
| Intel Trusted Execution Technology |
N |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
| Intel Demand Based Switching |
N |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
N |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
Storage
| Total storage capacity |
440.4 GB |
Ports & interfaces
| PS/2 ports quantity |
2 |
| Serial ports quantity |
2 |
| VGA (D-Sub) ports quantity |
1 |
Memory
| Maximum internal memory |
64 GB |
| Memory slots |
16 DIMM |
| Internal memory |
2 GB |
| Internal memory type |
DDR2-SDRAM |
| ECC |
Y |
Processor
| Processor cores |
2 |
| Processor operating modes |
64-bit |
| Embedded options available |
N |
| FSB Parity |
Y |
| Number of Processing Die Transistors |
1328 M |
| Execute Disable Bit |
Y |
| Processor cache |
4 MB |
| Number of processors installed |
1 |
| Maximum number of SMP processors |
4 |
| Thermal Design Power (TDP) |
95 W |
| CPU multiplier (bus/core ratio) |
15 |
| Processor lithography |
65 nm |
| Processor package size |
53.3 mm |
| Processor front side bus |
667 MHz |
| Conflict Free processor |
N |
| Processor cache type |
L2 |
| Thermal Monitoring Technologies |
N |
| Bus type |
FSB |
| ECC supported by processor |
N |
| Tcase |
60 °C |
| Processor frequency |
2.5 GHz |
Graphics
| Maximum graphics adapter memory |
16 MB |
Design
| Chassis type |
Rack (3U) |
| Optical drive type |
DVD-ROM |
Networking
| Networking features |
Gigabit Ethernet |
Additionally
| Processing die size |
435 mm² |
| Ethernet LAN (RJ-45) ports quantity |
2 |
| InTru™ 3D Technology |
N |
| Intel AES New Instructions |
N |
| Graphics |
Radeon 7000M |
System x3850, 1x Xeon 7110N (2.50 GHz/667 MHz, 2x 1 MB L2 cache/core, 4 MB L3 Cache), 2 x 1 GB PC2-3200 DDR2 ECC Memory, 0 GB SAS HD (open bay), BMC, 2x Broadcom 5704 Gigabit Ethernet, SVGA (16MB), 1x 1300 W
The IBM System x3850 delivers outstanding performance, extremely low latency and high availability and manageability along with advanced, integrated technologies that help protect your IT investment. The x3850 is designed with IBM X3 Architecture, the third generation of mainframe-inspired IBM Enterprise X-Architecture Technology, and 64-bit Intel Xeon Processors MP. Driving mission-critical applications including Enterprise Resource Planning, database serving or custom-developed, Java™ technology-based applications like IBM WebSphere® software, the x3850 excels at performing transaction-intensive, back-office functions.
