Processor special features
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
N |
| Intel Hyper-Threading Technology |
Y |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
N |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
28029 |
| Intel® Turbo Boost Technology |
N |
| Intel Trusted Execution Technology |
N |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
| Intel Demand Based Switching |
N |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
N |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
Storage
| Total storage capacity |
440.4 GB |
Ports & interfaces
| PS/2 ports quantity |
2 |
| Serial ports quantity |
2 |
| VGA (D-Sub) ports quantity |
1 |
Memory
| Maximum internal memory |
64 GB |
| ECC |
Y |
| Internal memory type |
DDR2-SDRAM |
| Internal memory |
4 GB |
Processor
| Processor operating modes |
64-bit |
| Embedded options available |
N |
| FSB Parity |
Y |
| Number of Processing Die Transistors |
1328 M |
| Processor front side bus |
667 MHz |
| Conflict Free processor |
N |
| Processor cache type |
L2 |
| Processor code |
SL9YR |
| Processor cores |
2 |
| Thermal Design Power (TDP) |
150 W |
| Thermal Monitoring Technologies |
N |
| Execute Disable Bit |
Y |
| Processor cache |
16 MB |
| Number of processors installed |
2 |
| Maximum number of SMP processors |
4 |
| Processor lithography |
65 nm |
| Processor package size |
53.3 mm |
| ECC supported by processor |
N |
| Tcase |
69 °C |
| Processor frequency |
3.5 GHz |
| Bus type |
FSB |
Graphics
| Maximum graphics adapter memory |
16 MB |
Design
| Optical drive type |
DVD-ROM |
| Chassis type |
Rack (3U) |
Networking
| Networking features |
Gigabit Ethernet |
Additionally
| Processing die size |
435 mm² |
| InTru™ 3D Technology |
N |
| Intel AES New Instructions |
N |
| Graphics |
Radeon 7000M |
| Ethernet LAN (RJ-45) ports quantity |
2 |
System x3850, 2x Xeon 7150N 3.50 GHz/667 MHz (2x 1 MB L2 cache/16 MB L3 cache), 2 x 2 GB PC2-3200 CL3 ECC DDR2 SDRAM RDIMM, 0 GB SAS HD (open bay), BMC, RSA-2, ServeRAID-8i, 2x Broadcom 5704 Gigabit Ethernet, SVGA (16 MB) video, 2x 1300 W hot-swap power supply
The IBM System x3850 delivers outstanding performance, extremely low latency and high availability and manageability along with advanced, integrated technologies that help protect your IT investment. The x3850 is designed with IBM X3 Architecture, the third generation of mainframe-inspired IBM Enterprise X-Architecture Technology, and 64-bit Intel Xeon Processors MP. Driving mission-critical applications including Enterprise Resource Planning, database serving or custom-developed, Java™ technology-based applications like IBM WebSphere® software, the x3850 excels at performing transaction-intensive, back-office functions.
