Processor special features
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel Enhanced Halt State |
N |
| Intel® Turbo Boost Technology |
N |
| Intel Hyper-Threading Technology |
N |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
N |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
36947 |
| Intel Trusted Execution Technology |
N |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
N |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
| Intel Demand Based Switching |
Y |
Processor
| Stepping |
A1 |
| Processor operating modes |
64-bit |
| Embedded options available |
N |
| FSB Parity |
Y |
| Number of Processing Die Transistors |
1900 M |
| Processor front side bus |
1066 MHz |
| CPU multiplier (bus/core ratio) |
10 |
| Conflict Free processor |
N |
| Processor cache type |
L2 |
| Processor code |
SLG9P |
| Thermal Monitoring Technologies |
N |
| Execute Disable Bit |
Y |
| Processor cache |
16 MB |
| Number of processors installed |
2 |
| Processor cores |
6 |
| Thermal Design Power (TDP) |
130 W |
| Processor lithography |
45 nm |
| Processor package size |
53.3 mm |
| Processor frequency |
2.66 GHz |
| Bus type |
FSB |
| ECC supported by processor |
N |
| Tcase |
64 °C |
Memory
| Maximum internal memory |
256 GB |
| Memory slots |
32 DIMM |
| Internal memory type |
DDR2-SDRAM |
| Memory clock speed |
667 MHz |
| ECC |
Y |
| Internal memory |
16 GB |
Storage
| Hot-swap |
Y |
| Hard drive size |
2.5 " |
| Hard drive interface |
Serial Attached SCSI (SAS) |
| RAID support |
Y |
| Maximum storage capacity |
1.2 TB |
Power
| Number of power supply units |
2 |
| Power supply |
1440 W |
Graphics
| Maximum graphics adapter memory |
16 MB |
Design
| Chassis type |
Rack (4U) |
| Optical drive type |
N |
Ports & interfaces
| Serial ports quantity |
1 |
| VGA (D-Sub) ports quantity |
1 |
Networking
| Networking features |
Gigabit Ethernet |
Additionally
| Processing die size |
503 mm² |
| InTru™ 3D Technology |
N |
| Ethernet LAN (RJ-45) ports quantity |
3 |
| Ethernet LAN connection |
Y |
| Graphics |
RN50 |
| Intel AES New Instructions |
N |
2x Six-Core Intel Xeon x7460 2.66 GHz/1066 MHz (9 MB L2 cache/16 MB L3 cache), 8x 2 GB PC2-5300 ECC DDR2 SDRAM memory, 0x 0 GB hot-swap SAS hard drive (open bay), Integrated Broadcom 5709 Dual-port 10/100/1000 Ethernet, ATI RN50 SVGA video (16 MB), 2x 1440 W hot-swap power supply
- Outstanding commercial application serving and database performance
- Balanced system design supports more applications and help clients manage expanding business needs
- Mission-critical availability to help prevent interruptions in day-to-day enterprise operations
- High-bandwidth, low-latency memory subsystem built on DDR II registered DIMM technology
- Go green and save through server memory technology using less power and new, high-efficiency power supplies
Built on the next generation of Enterprise X-Architecture® servers, the IBM System x3850 M2 takes performance, efficiency and reliability to the next level. Featuring an unmatched combination of x86 performance and scalability with a balanced design, the x3850 M2 delivers unrivaled reliability, providing confidence in your IT solution deployments. An easy upgrade path provides the necessary flexibility to deliver an optimized solution for scale-up database, enterprise applications and server consolidation through virtualization services.
