Intel BB5500HCV Intel 5520 Socket B (LGA 1366) SSI EEB server/workstation motherboard

Intel BB5500HCV Intel 5520 Socket B (LGA 1366) SSI EEB server/workstation motherboard

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Technical specifications

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Design

Component for Server

Storage controllers

RAID support Y
Hard drive interface Serial ATA

Back panel I/O ports

PS/2 ports quantity 2
Serial ports quantity 2

Performance

Embedded options available Y
Memory bandwidth (max) 64 GB/s
Low halogen options available N

Processor

Processor manufacturer Intel
Number of QPI links 3
Number of processors supported 2
Thermal power 130 W
Processor number of cores supported 4, 6

Technical details

Maximum number of PCI Express lanes 24

Memory

ECC Y
Maximum internal memory 144 GB
Supported memory types DDR3-SDRAM

Expansion slots

PCI Express x8 slots 2
PCI Express x16 slots 1

Graphics

On-board graphics adapter Y

Processor special features

Intel Intelligent Power Node Manager Y

Internal I/O

Number of SATA connectors 6

Additionally

Ethernet LAN connection Y
Chipset Intel 5520
Ethernet LAN (RJ-45) ports quantity 2
Intel Server Board S5500HCV <b>Embedded Options Available</b>
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

<b>ECC Memory Supported</b>
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

<b>Integrated Graphics</b>
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

<b>Intel® Node Manager</b>
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
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