Intel HNS2600KPF

Intel HNS2600KPF

EAN: 675901266901
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Technical specifications

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Technical details

ECC supported by processor Y
Form factor Custom 6.4" x 17.7"
Maximum internal memory supported by processor 512 GB
Maximum memory 512 GB
USB ports quantity 4
Halogen free N
Supported RAID configuration Up to SW Raid 5 (ESRT2 or RSTE)
Product name Intel Compute Module HNS2600KPF
Launch date 2014-09-08T00:00:00
Born on date Q4'14
Market segment SRV
Intel Virtualization Technology for Directed I/O (VT-d) Y
Total number of SATA connectors 10
Memory bandwidth supported by processor (max) 115 GB/s
Physical Address Extension (PAE) 46 bit
Status End of Life
Connector for Intel I/O Expansion Module x8 Gen 3 1
Maximum number of PCI Express lanes 64
Thermal Design Power (TDP) 145 W
Hot-Plug support Y
USB version 2.0

Networking

Wi-Fi N

Processor special features

Intel® Virtualization Technology (Intel® VT) VT-d
Intel Quiet System Technology (QST) Y
Intel Efficient Power Technology Y
Intel Quiet Thermal Technology Y
Intel Server Customization Technology Y
Intel Remote Management Module Support Y
Intel Server Management Software Y
Intel I/O Acceleration Technology Y
Intel Advanced Management Technology Y
Connector for Intel I/O Expansion Module 1
Intel Rapid Storage Technology enterprise Y
Intelligent Platform Management Interface (IPMI) support Y
Intel Build Assurance Technology Y
Intel Trusted Execution Technology N
Intel Flex Memory Access Y
Intel Fast Memory Access Y
Intel Intelligent Power Node Manager Y

Expansion slots

PCI Express slots version 3.0
PCI Express x16 (Gen 3.x) slots 2
PCI Express x16 slots 2
PCI Express x8 (Gen 3.x) slots 1

Back panel I/O ports

VGA (D-Sub) ports quantity 1
Serial ports quantity 1

Design

Chassis type Rack
Product codename Kennedy Pass
Product series Intel HNS2600KP
Product family Intel compute module
Component for Server

Processor

Lithography 22 nm
CPU configuration (max) 2
Processor manufacturer Intel
Supported QPI 9.6, 8, 6.4 GT/s
Number of QPI links 2
Number of processors supported 2
Thermal power 145 W
Processor number of cores supported 10, 14, 18, 4, 8, 6, 16, 12

Memory

Maximum LRDIMM memory 512 GB
Supported LRDIMM clock speeds 1866, 1600, 2133 MHz
Maximum RDIMM memory 512 GB
Supported RDIMM clock speeds 2133, 1866, 1600 MHz
Memory channels Octa
ECC Y
Number of DIMM slots 8
Maximum internal memory 512 GB
Supported memory types DDR4-SDRAM

Performance

Integrated systems available N
Embedded options available N
Rack-Friendly board Y
Physical Address Extension (PAE) Y
Motherboard ARK ID 79090
Memory bandwidth (max) 115 GB/s
Low halogen options available N
Integrated BMC with IPMI Y
InfiniBand Y

Graphics

Discrete graphics support Y
Graphics output VGA
On-board graphics adapter Y

Storage controllers

RAID support Y
Hard drive interface Serial ATA

Additionally

Intel AES New Instructions Y
Ethernet LAN connection Y
Количество слотов PCI Express 64
Chipset Intel C612
Ethernet LAN (RJ-45) ports quantity 2
Compute Module HNS2600KPF A hot-pluggable high-density compute module integrated with the Intel® Server Board S2600KPF for higher memory bandwidth, InfiniBand FDR (56-Gb/s), and flexible configuration options for Intel® Server Chassis H2000 family.

Two socket, high-density, half-width server board with eight DIMMS per board for high performance computing and big data solutions.

- Supports two Intel® Xeon® processor E5-2600 v3, 145 W maximum
- Eight memory sockets support LR/R-DIMMs, up to 512 GB maximum memory per node
- Custom half-width form factor (6.4-inch width x 17.7-inch length), up to 4 nodes per 2U
- Three risers with 64 I/O lanes available per board
- Board models with or without integrated FDR InfiniBand
- Dual integrated 1 GbE network controller and an integrated management port
- All nodes, power supplies, and storage are hot swappable
- Mechanically compatible board to Intel® Server Board S2600JF family

<b>Target applications</b>
The Intel Server Board S2600KP family is ideal for high performance computing (HPC) and big data environments where highly demanding distributed processing and intensive application workloads rely on maximum compute density and performance for powerful results.
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