Technical details
ECC supported by processor |
Y |
Form factor |
Custom 6.8" x 18.9" |
Maximum internal memory supported by processor |
1024 GB |
Maximum memory |
1024 GB |
USB ports quantity |
4 |
Halogen free |
N |
USB version |
2.0 |
Supported RAID configuration |
Up to SW Raid 5 (LSI or RSTE) |
Product name |
Intel Compute Module HNS2600TPF |
Launch date |
2015-01-09T00:00:00 |
Born on date |
Q1'15 |
Market segment |
SRV |
Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
Total number of SATA connectors |
10 |
Memory bandwidth supported by processor (max) |
115 GB/s |
Physical Address Extension (PAE) |
46 bit |
Status |
End of Life |
Connector for Intel I/O Expansion Module x8 Gen 3 |
1 |
Maximum number of PCI Express lanes |
80 |
Thermal Design Power (TDP) |
145 W |
Hot-Plug support |
Y |
Processor special features
Intel® Virtualization Technology (Intel® VT) |
VT-d |
Intel Quiet System Technology (QST) |
Y |
Intel Efficient Power Technology |
Y |
Intel Quiet Thermal Technology |
Y |
Intel Server Customization Technology |
Y |
Intel Remote Management Module Support |
Y |
Intel Server Management Software |
Y |
Intel I/O Acceleration Technology |
Y |
Intel Advanced Management Technology |
Y |
Connector for Intel I/O Expansion Module |
1 |
Intel Rapid Storage Technology enterprise |
Y |
Intelligent Platform Management Interface (IPMI) support |
Y |
Intel Build Assurance Technology |
Y |
Intel Trusted Execution Technology |
N |
Intel Flex Memory Access |
Y |
Intel Fast Memory Access |
Y |
Intel Intelligent Power Node Manager |
Y |
Design
Component for |
Server |
Chassis type |
Rack |
Product codename |
Taylor Pass |
Product series |
Intel HNS2600TP |
Product family |
Intel compute module |
Expansion slots
PCI Express slots version |
3.0 |
PCI Express x16 (Gen 3.x) slots |
1 |
PCI Express x16 slots |
1 |
Storage controllers
RAID support |
Y |
Hard drive interface |
Serial ATA |
Back panel I/O ports
VGA (D-Sub) ports quantity |
1 |
Serial ports quantity |
1 |
Processor
Lithography |
22 nm |
CPU configuration (max) |
2 |
Processor manufacturer |
Intel |
Supported QPI |
9.6, 8, 6.4 GT/s |
Number of QPI links |
2 |
Number of processors supported |
2 |
Thermal power |
145 W |
Processor number of cores supported |
10, 14, 18, 4, 8, 6, 16, 12 |
Memory
Maximum LRDIMM memory |
1024 GB |
Supported LRDIMM clock speeds |
1866, 1600, 2133 MHz |
Maximum RDIMM memory |
1024 GB |
Supported RDIMM clock speeds |
2133, 1866, 1600 MHz |
Memory channels |
Octa |
ECC |
Y |
Number of DIMM slots |
16 |
Maximum internal memory |
1024 GB |
Supported memory types |
DDR4-SDRAM |
Performance
Integrated systems available |
N |
Embedded options available |
N |
Rack-Friendly board |
Y |
Physical Address Extension (PAE) |
Y |
Motherboard ARK ID |
83034 |
Memory bandwidth (max) |
115 GB/s |
Integrated BMC with IPMI |
Y |
InfiniBand |
Y |
Graphics
Discrete graphics support |
Y |
Graphics output |
VGA |
On-board graphics adapter |
Y |
Additionally
Intel AES New Instructions |
Y |
Ethernet LAN connection |
Y |
Количество слотов PCI Express |
80 |
Chipset |
Intel C612 |
Ethernet LAN (RJ-45) ports quantity |
2 |
Compute Module HNS2600TPF
A hot-pluggable high density compute module integrated with Intel® Server Board S2600TPF for higher memory capability and flexible configuration options for the Intel® Server Chassis H2000 family.
- Supports two Intel® Xeon® processor E5-2600 v3, 145 W maximum
- Eight memory sockets support LR/R-DIMMs, up to 512 GB maximum memory per node
- Custom half-width form factor (6.4-inch width x 17.7-inch length), up to 4 nodes per 2U
- Three risers with 64 I/O lanes available per board
- Board models with or without integrated FDR InfiniBand
- Dual integrated 1 GbE network controller and an integrated management port
- All nodes, power supplies, and storage are hot swappable
- Mechanically compatible board to Intel® Server Board S2600JF family
<b>Target applications</b>
The Intel Server Board S2600KP family is ideal for high performance computing (HPC) and big data environments where highly demanding distributed processing and intensive application workloads rely on maximum compute density and performance for powerful results.