Intel S2600WTT

Intel S2600WTT

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Technical specifications

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Processor special features

Intel Matrix Storage Technology N
Intel® Virtualization Technology (Intel® VT) VT-d
Intel Quick Resume Technology N
Intel Quiet System Technology (QST) N
Intel Efficient Power Technology Y
Intel Quiet Thermal Technology Y
Intel Server Customization Technology Y
Intel Remote Management Module Support Y
Intel Server Management Software Y
Intel I/O Acceleration Technology Y
Intel Advanced Management Technology Y
Connector for Intel I/O Expansion Module 1
Intel Rapid Storage Technology enterprise Y
Internal I/O Expansion Module x8 Gen 3 1
Intelligent Platform Management Interface (IPMI) support Y
Intel Build Assurance Technology Y
Intel Trusted Execution Technology Y
Intel Flex Memory Access Y
Intel Fast Memory Access Y
Intel Intelligent Power Node Manager Y

Technical details

ECC supported by processor Y
Form factor Custom 16.7" x 17"
Maximum internal memory supported by processor 1536 GB
Maximum memory 1536 GB
USB ports quantity 8
Halogen free N
Supported RAID configuration SW RAID 0, 1, 10, optional 5
Product name Intel Server Board S2600WTT
Launch date 2014-11-07T00:00:00
Firewire support N
Born on date Q4'14
Market segment SRV
Intel Virtualization Technology for Directed I/O (VT-d) Y
Total number of SATA connectors 10
Memory bandwidth supported by processor (max) 115 GB/s
Physical Address Extension (PAE) 46 bit
Status End of Life
Connector for Intel I/O Expansion Module x8 Gen 3 1
Maximum number of PCI Express lanes 84
Thermal Design Power (TDP) 145 W
Intel Rapid Storage Technology N

Networking

Wi-Fi N

Design

Component for Server
Chassis type Rack
Product codename Wildcat Pass
Product series Intel S2600WT
Product family Dual-socket server board

Expansion slots

PCI Express slots version 3.0
PCI Express x4 (Gen 3.x) slots 1
PCI Express x4 slots 1
PCI Express x8 slots 1
PCI Express x8 (Gen 3.x) slots 1

Storage controllers

RAID support Y
Hard drive interface Serial ATA

Back panel I/O ports

VGA (D-Sub) ports quantity 1
Serial ports quantity 2

Processor

Lithography 22 nm
CPU configuration (max) 2
Processor manufacturer Intel
Supported QPI 9.6, 8, 6.4 GT/s
Number of QPI links 2
Number of processors supported 2
Thermal power 145 W
Processor number of cores supported 61, 10, 14, 18, 4, 8, 6, 16, 57

Memory

Maximum LRDIMM memory 3072 GB
Supported LRDIMM clock speeds 1866, 2133 MHz
Maximum RDIMM memory 3072 GB
Supported RDIMM clock speeds 2133, 1866, 1600 MHz
Memory channels Octa
ECC Y
Maximum internal memory 3072 GB
Supported memory types DDR4-SDRAM

Performance

Integrated systems available Y
Trusted Platform Module (TPM) Y
Embedded options available N
Rack-Friendly board Y
Embedded USB (eUSB) SSD option Y
Physical Address Extension (PAE) Y
Motherboard ARK ID 82156
Memory bandwidth (max) 115 GB/s
Trusted Platform Module (TPM) version 1.2
Low halogen options available N
Integrated BMC with IPMI Y
InfiniBand N

Graphics

Discrete graphics support Y
Graphics output VGA
On-board graphics adapter Y

Additionally

Intel AES New Instructions Y
Ethernet LAN connection Y
Intel HD Audio Technology N
Количество слотов PCI Express 84
Ethernet LAN (RJ-45) ports quantity 2
Server Board S2600WTT A rack optimized server board supporting two Intel® Xeon® processor E5-2600 V3 family up to 145W, 24 DIMMs, and two 10-Gb ethernet ports.

- Supports two Intel® Xeon® processor E5-2600 v3, 145 W maximum
- Eight memory sockets support LR/R-DIMMs, up to 512 GB maximum memory per node
- Custom half-width form factor (6.4-inch width x 17.7-inch length), up to 4 nodes per 2U
- Three risers with 64 I/O lanes available per board
- Board models with or without integrated FDR InfiniBand
- Dual integrated 1 GbE network controller and an integrated management port
- All nodes, power supplies, and storage are hot swappable
- Mechanically compatible board to Intel® Server Board S2600JF family

<b>Target applications</b>
The Intel Server Board S2600KP family is ideal for high performance computing (HPC) and big data environments where highly demanding distributed processing and intensive application workloads rely on maximum compute density and performance for powerful results.
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