Processor
| Processor cache |
1 MB |
| Processor lithography |
90 nm |
| Processor codename |
Prescott |
| Processor cache type |
L2 |
| Processor front side bus |
800 MHz |
| FSB Parity |
N |
| CPU multiplier (bus/core ratio) |
16 |
| Processor socket |
LGA 775 (Socket T) |
| Processor threads |
2 |
| Processor cores |
1 |
| Processor frequency |
3.2 GHz |
| Bus type |
FSB |
Features
| Execute Disable Bit |
N |
| Thermal Design Power (TDP) |
84 W |
| Processor package size |
37.5 x 37.5 mm |
| Processor ARK ID |
27466 |
| Number of Processing Die Transistors |
125 M |
| Embedded options available |
N |
Processor special features
| Intel Trusted Execution Technology |
N |
| Conflict Free processor |
N |
| Intel 64 |
N |
| Intel Hyper-Threading Technology |
Y |
| Intel® Turbo Boost Technology |
N |
| Intel Enhanced Halt State |
N |
| Enhanced Intel SpeedStep Technology |
N |
| Intel Demand Based Switching |
N |
Technical details
| Processor cache |
1024 KB |
| Status |
End of Interactive Support |
| Product family |
Legacy Intel Pentium Processor |
| Product type |
1 |
Additionally
| Processing die size |
112 mm² |
Intel® Pentium® 4 Processor 540/540J supporting HT Technology
(1M Cache, 3.20 GHz, 800 MHz FSB)
Introducing the boxed Intel® Pentium® 4 processor with HT Technology in the new LGA 775 package manufactured on Intel’s industry-leading 90nm process technology. Combined with the new Intel® 925X, 915P and 915G Express Chipsets† this new Intel® desktop platform enables new technologies to power today's applications and emerging PC entertainment such as high definition video and audio.
Note: To help meet the required processor thermal specifications, an internal ambient temperature at or below 38º C is required. It is strongly recommended to use a Thermally Advantaged Chassis (TAC) based on Chassis Air Guide 1.1 or equivalent.
With these new processors, Intel has introduced processor numbers as a means to identify the various features of the Pentium® 4 processor in the LGA775 package.
