Processor
Maximum internal memory supported by processor |
288 GB |
Processor frequency |
2.26 GHz |
Stepping |
B1 |
Processor operating modes |
64-bit |
Embedded options available |
N |
FSB Parity |
N |
Processor front side bus |
1066 MHz |
Conflict Free processor |
N |
Memory bandwidth supported by processor (max) |
25.6 GB/s |
Processor cache type |
Smart Cache |
Processor code |
SLBZ9 |
Physical Address Extension (PAE) |
40 bit |
Thermal Monitoring Technologies |
N |
Execute Disable Bit |
Y |
Processor cores |
4 |
Thermal Design Power (TDP) |
80 W |
CPU multiplier (bus/core ratio) |
17 |
Processor lithography |
32 nm |
Processor package size |
42.5 mm |
Number of QPI links |
2 |
Processor cache |
8 MB |
Number of processors installed |
1 |
Maximum number of SMP processors |
2 |
ECC supported by processor |
Y |
Bus type |
QPI |
Supported instruction sets |
SSE4.2 |
Processor special features
Intel Clear Video Technology for MID |
N |
Intel® My WiFi Technology (Intel® MWT) |
N |
Intel Enhanced Halt State |
Y |
Intel Hyper-Threading Technology |
N |
Intel® Anti-Theft Technology (Intel® AT) |
N |
Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
CPU configuration (max) |
2 |
Intel Dual Display Capable Technology |
N |
Intel Clear Video Technology |
N |
Intel 64 |
Y |
Intel® Insider™ |
N |
Intel® Quick Sync Video Technology |
N |
Processor ARK ID |
52582 |
Intel Trusted Execution Technology |
Y |
Intel Flex Memory Access |
N |
Intel Fast Memory Access |
N |
Intel® Turbo Boost Technology |
N |
Intel Rapid Storage Technology |
N |
Intel® Wireless Display (Intel® WiDi) |
N |
Intel Demand Based Switching |
Y |
Enhanced Intel SpeedStep Technology |
Y |
Intel FDI Technology |
N |
Intel VT-x with Extended Page Tables (EPT) |
Y |
Intel vPro Technology |
N |
Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
Storage
RAID support |
Y |
Maximum storage capacity |
4 TB |
Number of hard drives supported |
4 |
Hot-swap |
Y |
Hard drive size |
2.5 " |
Memory
Maximum internal memory |
192 GB |
Memory slots |
18 x DIMM |
Memory layout (slots x size) |
1 x 4 GB |
Memory clock speed |
1066 MHz |
ECC |
Y |
Internal memory |
4 GB |
Internal memory type |
DDR3-SDRAM |
Other features
Mac compatibility |
N |
Disk array controller |
LSI 1068 |
Graphics adapter family |
Matrox |
Power
Number of power supply units |
1 |
Power supply type |
AC/DC |
Power supply |
460 W |
Networking
LAN controller |
Broadcom BCM5709S |
Wake-on-LAN ready |
Y |
Networking features |
Gigabit Ethernet |
Design
Chassis type |
Rack (1U) |
Optical drive type |
N |
Graphics
Maximum graphics adapter memory |
16 MB |
Ports & interfaces
Serial ports quantity |
1 |
VGA (D-Sub) ports quantity |
1 |
Operational conditions
Operating altitude |
914.4 - 2133 m |
Certificates
Compliance industry standards |
IEEE 802.3, IEEE 802.3u, IEEE 802.3ab |
Energy Star certified |
Y |
Additionally
System bus data transfer rate |
4.8 GT/s |
Graphics |
G200eV |
Chipset |
Intel 5520 |
InTru™ 3D Technology |
N |
Ethernet LAN (RJ-45) ports quantity |
2 |
Intel AES New Instructions |
Y |
Ethernet LAN connection |
Y |
x3550 M3, Intel Xeon E5607 (8M Cache, 2.26 GHz, 4.80 GT/s Intel QPI), 4GB DDR3, 4 x 2.5" SAS/SATA HDD, Hot-Swap, 2 x RJ-45, Gigabit Ethernet, 4 x USB 2.0, Rack/1U
Highlights
- Get higher performance per watt for greater cost efficiency.
- Simplify management and serviceability with flexible design.
- Maintain availability and lower risk through a resilient architecture.
Innovative technology in slim package
The IBM System x3550 M3 builds on the latest Intel ® Xeon® processor technology with extreme processing power and superior energy-management and cooling features. With twice the performance of previous generations and a flexible, energy-smart design that integrates low-wattage components, the x3550 M3 can help you meet demanding workloads at a lower cost per watt.
Simplifying management and serviceability
The x3550 M3 offers a flexible, scalable design and simple upgrade path from four to eight hard disk drives. Comprehensive systems management tools such as advanced diagnostics and the ability to control resources from a single point make it easy to deploy, integrate, service and manage.
Product features
- Power-optimized performance that leverages the speed of new Intel processors with more capacity and memory.
- Innovative, energy-smart 1U design to help lower operational costs.
- Energy-efficient design with UDIMMs, 40 W processing and UEFI BIOS.
- Better serviceability with a highly scalable, flexible design that is easy to deploy, integrate, service and manage.
- Easier risk management with resilient architectures and virtualized environments.
Hardware summary
- 1U chassis.
- Up to two 3.46 GHz six-core (3.60 GHz four-core) Intel Xeon 5600 series processors with QuickPath Interconnect technology, up to 1333 MHz memory access speed.
- Up to 192 GB RDIMMs or 48 GB UDIMMs high-performance, new generation DDR-3 memory.
- Internal storage flexibility with up to eight 2.5" hot-swap SAS/SATA HDDs or SSDs.
- Up to 2 PCIe slots.
- Low 675 W design and up to 94% efficient power supplies, six cooling fan modules, new UEFI BIOS, altimeter monitored by Integrated Management Module and IBM Systems Director Active Energy Manager™.
- NEBS 1/ETSI equivalent compliance for both AC and DC power supply (model dependent).
- Compliant with 80-PLUS® and ENERGY STAR® energy-efficiency standards (model dependent).
- VMware ESXi embedded hypervisor support with optional 2 GB USB key for virtualization.