Processor
| Maximum internal memory supported by processor |
288 GB |
| Processor frequency |
3.46 GHz |
| Stepping |
B1 |
| Processor operating modes |
64-bit |
| Embedded options available |
N |
| FSB Parity |
N |
| Processor front side bus |
1333 MHz |
| Conflict Free processor |
N |
| Physical Address Extension (PAE) |
Y |
| Memory channels supported by processor |
Triple |
| Memory bandwidth supported by processor (max) |
32 GB/s |
| Memory clock speeds supported by processor |
1333, 1066, 800 MHz |
| Processor cache type |
Smart Cache |
| Processor code |
SLBVX |
| Physical Address Extension (PAE) |
40 bit |
| Thermal Monitoring Technologies |
N |
| Idle States |
Y |
| Execute Disable Bit |
Y |
| Number of QPI links |
2 |
| Processor cache |
12 MB |
| Processor cores |
6 |
| Thermal Design Power (TDP) |
130 W |
| CPU multiplier (bus/core ratio) |
26 |
| Processor lithography |
32 nm |
| Processor package size |
42.5 mm |
| Processor boost frequency |
3.73 GHz |
| Number of processors installed |
1 |
| Maximum number of SMP processors |
2 |
| Tcase |
78.5 °C |
| Bus type |
QPI |
| Memory types supported by processor |
DDR3-SDRAM |
| Supported instruction sets |
SSE4.2 |
| ECC supported by processor |
Y |
Processor special features
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
Y |
| Intel Hyper-Threading Technology |
Y |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
| CPU configuration (max) |
2 |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
52576 |
| Intel Virtualization Technology (VT-x) |
Y |
| Intel Trusted Execution Technology |
Y |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Turbo Boost Technology |
Y |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
N |
| Intel vPro Technology |
N |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
| Intel Demand Based Switching |
Y |
Storage
| RAID support |
Y |
| Maximum storage capacity |
8 TB |
| Number of hard drives supported |
8 |
| Hot-swap |
Y |
| Hard drive size |
2.5 " |
Memory
| Maximum internal memory |
192 GB |
| Memory slots |
18 x DIMM |
| Memory layout (slots x size) |
1 x 4 GB |
| Memory clock speed |
1066 MHz |
| ECC |
Y |
| Internal memory |
4 GB |
| Internal memory type |
DDR3-SDRAM |
Other features
| Mac compatibility |
N |
| Disk array controller |
LSI 1068 |
| Graphics adapter family |
Matrox |
Power
| Number of power supply units |
1 |
| Power supply type |
AC/DC |
| Power supply |
675 W |
Networking
| LAN controller |
Broadcom BCM5709S |
| Wake-on-LAN ready |
Y |
| Networking features |
Gigabit Ethernet |
Design
| Optical drive type |
N |
| Chassis type |
Rack (1U) |
Graphics
| Maximum graphics adapter memory |
16 MB |
Ports & interfaces
| Serial ports quantity |
1 |
| VGA (D-Sub) ports quantity |
1 |
Operational conditions
| Operating altitude |
914.4 - 2133 m |
Certificates
| Compliance industry standards |
IEEE 802.3, IEEE 802.3u, IEEE 802.3ab |
| Energy Star certified |
Y |
Additionally
| System bus data transfer rate |
6.4 GT/s |
| Graphics |
G200eV |
| Chipset |
Intel 5520 |
| InTru™ 3D Technology |
N |
| Ethernet LAN connection |
Y |
| Intel AES New Instructions |
Y |
| Ethernet LAN (RJ-45) ports quantity |
2 |
x3550 M3, Intel Xeon X5690 (12M Cache, 3.46 GHz, 6.40 GT/s Intel QPI), 4GB DDR3, 8 x 2.5" SAS/SATA HDD, Hot-Swap, 2 x RJ-45, Gigabit Ethernet, 4 x USB 2.0, Rack/1U
Highlights
- Get higher performance per watt for greater cost efficiency.
- Simplify management and serviceability with flexible design.
- Maintain availability and lower risk through a resilient architecture.
Innovative technology in slim package
The IBM System x3550 M3 builds on the latest Intel ® Xeon® processor technology with extreme processing power and superior energy-management and cooling features. With twice the performance of previous generations and a flexible, energy-smart design that integrates low-wattage components, the x3550 M3 can help you meet demanding workloads at a lower cost per watt.
Simplifying management and serviceability
The x3550 M3 offers a flexible, scalable design and simple upgrade path from four to eight hard disk drives. Comprehensive systems management tools such as advanced diagnostics and the ability to control resources from a single point make it easy to deploy, integrate, service and manage.
Product features
- Power-optimized performance that leverages the speed of new Intel processors with more capacity and memory.
- Innovative, energy-smart 1U design to help lower operational costs.
- Energy-efficient design with UDIMMs, 40 W processing and UEFI BIOS.
- Better serviceability with a highly scalable, flexible design that is easy to deploy, integrate, service and manage.
- Easier risk management with resilient architectures and virtualized environments.
Hardware summary
- 1U chassis.
- Up to two 3.46 GHz six-core (3.60 GHz four-core) Intel Xeon 5600 series processors with QuickPath Interconnect technology, up to 1333 MHz memory access speed.
- Up to 192 GB RDIMMs or 48 GB UDIMMs high-performance, new generation DDR-3 memory.
- Internal storage flexibility with up to eight 2.5" hot-swap SAS/SATA HDDs or SSDs.
- Up to 2 PCIe slots.
- Low 675 W design and up to 94% efficient power supplies, six cooling fan modules, new UEFI BIOS, altimeter monitored by Integrated Management Module and IBM Systems Director Active Energy Manager™.
- NEBS 1/ETSI equivalent compliance for both AC and DC power supply (model dependent).
- Compliant with 80-PLUS® and ENERGY STAR® energy-efficiency standards (model dependent).
- VMware ESXi embedded hypervisor support with optional 2 GB USB key for virtualization.
