Processor special features
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
| Intel Demand Based Switching |
Y |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
Y |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
Y |
| Intel Hyper-Threading Technology |
Y |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Turbo Boost Technology |
Y |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
| CPU configuration (max) |
2 |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
48768 |
| Intel Virtualization Technology (VT-x) |
Y |
| Intel Trusted Execution Technology |
Y |
Processor
| ECC supported by processor |
Y |
| Tcase |
76.2 °C |
| Maximum internal memory supported by processor |
288 GB |
| Processor frequency |
2.4 GHz |
| Stepping |
B1 |
| Processor operating modes |
64-bit |
| Idle States |
Y |
| Execute Disable Bit |
N |
| Number of QPI links |
2 |
| Processor boost frequency |
2.67 GHz |
| Processor cache |
12 MB |
| Number of processors installed |
2 |
| Processor cores |
6 |
| Maximum number of SMP processors |
2 |
| Thermal Design Power (TDP) |
80 W |
| CPU multiplier (bus/core ratio) |
18 |
| Processor lithography |
32 nm |
| Processor package size |
42.5 mm |
| Embedded options available |
Y |
| FSB Parity |
N |
| Conflict Free processor |
N |
| Memory channels supported by processor |
Triple |
| Memory bandwidth supported by processor (max) |
32 GB/s |
| Memory clock speeds supported by processor |
1333, 1066, 800 MHz |
| Processor cache type |
Smart Cache |
| Physical Address Extension (PAE) |
40 bit |
| Thermal Monitoring Technologies |
N |
| Bus type |
QPI |
| Memory types supported by processor |
DDR3-SDRAM |
| Supported instruction sets |
SSE4.2 |
Storage
| RAID support |
Y |
| Maximum storage capacity |
16 TB |
| Number of hard drives supported |
16 |
| Hard drive size |
2.5 " |
| Hot-swap |
Y |
Memory
| Maximum internal memory |
192 GB |
| Memory slots |
18 x DIMM |
| Internal memory |
8 GB |
| Internal memory type |
DDR3-SDRAM |
| Memory layout (slots x size) |
2 x 4 GB |
| Memory clock speed |
1333 MHz |
| ECC |
Y |
Other features
| Mac compatibility |
N |
| Disk array controller |
LSI 1068 |
| Graphics adapter family |
Matrox |
Graphics
| Maximum graphics adapter memory |
16 MB |
Networking
| Wake-on-LAN ready |
Y |
| LAN controller |
Broadcom BCM5709S |
| Networking features |
Gigabit Ethernet |
Design
| Chassis type |
Rack (2U) |
| Optical drive type |
N |
Ports & interfaces
| Serial ports quantity |
1 |
| VGA (D-Sub) ports quantity |
2 |
Power
| Number of power supply units |
2 |
| Power supply type |
AC/DC |
| Power supply |
460 W |
Operational conditions
| Operating altitude |
914.4 - 2133 m |
Certificates
| Compliance industry standards |
IEEE 802.3, IEEE 802.3u, IEEE 802.3ab |
| Energy Star certified |
Y |
Additionally
| Intel AES New Instructions |
Y |
| Ethernet LAN connection |
Y |
| System bus data transfer rate |
5.86 GT/s |
| Graphics |
G200eV |
| Ethernet LAN (RJ-45) ports quantity |
2 |
| Chipset |
Intel 5520 |
| InTru™ 3D Technology |
N |
x3650 M3, 2 x Intel Xeon E5645 (12M Cache, 2.40 GHz, 5.86 GT/s Intel QPI), 2 x 4GB DDR3, 16 x 2.5" SAS/SATA/SSD HDD, Hot-Swap, 2 x RJ-45, Gigabit Ethernet, 4 x USB 2.0, Rack/2U
Highlights:
- Improve cost-effectiveness with higher performance per watt.
- Simplify management and serviceability with flexible design.
- Manage risk with resilient architectures and virtualized environments.
Packed with innovation
The IBM System x3650 M3 provides outstanding performance for your mission-critical applications. Its energy-efficient design supports more cores, memory and data capacity in a scalable 2U package that’s easy to service and manage. With more computing power per watt and the latest Intel® Xeon® processors, you can reduce costs while maintaining speed and availability.
Simplify management and serviceability
The x3650 M3 offers a flexible, scalable design and simple upgrade path to 16 HDDs or SSDs, and 192 GB of memory. Comprehensive systems management tools such as advanced diagnostics, a cable management arm and the ability to control resources from a single point make it easy to deploy, integrate, service and manage.
Product features
- Power-optimized performance that leverages the speed of new Intel processors with more capacity and memory.
- Innovative, energy-smart 2U design to help lower operational costs.
- Energy-efficient design with UDIMMs, 40 W processing and UEFI BIOS.
- Better serviceability with a highly scalable, flexible design that is easy to deploy, integrate, service and manage.
- Easier risk management with resilient architectures and virtualized environments.
Hardware summary
- 2U chassis.
- Up to two 3.46 GHz six-core (3.60 GHz four-core) Intel Xeon 5600 series processors with QuickPath Interconnect technology, up to 1333 MHz memory access speed.
- Up to 192 GB RDIMMs or 48 GB UDIMMs high-performance, new-generation DDR-3 memory.
- Internal storage flexibility with up to sixteen 2.5" hot-swap SAS/SATA HDDs or SSDs.
- Up to four PCIe slots.
- Low 675 W design and up to 94% efficient power supplies, six cooling fan modules, new UEFI BIOS, altimeter monitored by Integrated Management Module and IBM Systems Director Active Energy Manager™.
- NEBS 1/ETSI equivalent compliance for both AC and DC power supplies (model dependent).
- Compliance with 80-PLUS® and ENERGY STAR® energy-efficiency standards (model dependent).
- VMware ESXi embedded hypervisor support with optional 2 GB USB key for virtualization.
