Processor special features
Intel VT-x with Extended Page Tables (EPT) |
Y |
Intel vPro Technology |
N |
Intel Enhanced Halt State |
Y |
Intel Hyper-Threading Technology |
Y |
Intel® Anti-Theft Technology (Intel® AT) |
N |
Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
CPU configuration (max) |
2 |
Intel Dual Display Capable Technology |
N |
Intel Clear Video Technology |
N |
Intel 64 |
Y |
Intel® Insider™ |
N |
Intel® Quick Sync Video Technology |
N |
Processor ARK ID |
47922 |
Intel Virtualization Technology (VT-x) |
Y |
Intel Trusted Execution Technology |
Y |
Intel Flex Memory Access |
N |
Intel Fast Memory Access |
N |
Intel Rapid Storage Technology |
N |
Intel® Turbo Boost Technology |
Y |
Intel Clear Video Technology for MID |
N |
Intel® My WiFi Technology (Intel® MWT) |
N |
Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
Intel® Wireless Display (Intel® WiDi) |
N |
Intel Demand Based Switching |
Y |
Enhanced Intel SpeedStep Technology |
Y |
Intel FDI Technology |
N |
Processor
Maximum internal memory supported by processor |
288 GB |
Processor frequency |
2.66 GHz |
Stepping |
B1 |
Processor system type |
DP |
Processor operating modes |
64-bit |
Embedded options available |
N |
FSB Parity |
N |
Conflict Free processor |
N |
Memory channels supported by processor |
Triple |
Memory bandwidth supported by processor (max) |
32 GB/s |
Memory clock speeds supported by processor |
1333, 1066, 800 MHz |
Processor cache type |
Smart Cache |
Processor code |
SLBV3 |
Physical Address Extension (PAE) |
40 bit |
Thermal Monitoring Technologies |
Y |
Idle States |
Y |
Execute Disable Bit |
Y |
Number of QPI links |
2 |
Processor cache |
12 MB |
Processor cores |
6 |
Thermal Design Power (TDP) |
95 W |
CPU multiplier (bus/core ratio) |
20 |
Processor lithography |
32 nm |
Processor package size |
42.5 mm |
Processor boost frequency |
3.06 GHz |
Number of processors installed |
2 |
Maximum number of SMP processors |
2 |
Bus type |
QPI |
Memory types supported by processor |
DDR3-SDRAM |
Supported instruction sets |
SSE4.2 |
ECC supported by processor |
Y |
Tcase |
81.3 °C |
Memory
Maximum internal memory |
192 GB |
Memory slots |
18 x DIMM |
Memory layout (slots x size) |
6 x 4 GB |
Memory clock speed |
1333 MHz |
ECC |
Y |
Internal memory |
24 GB |
Internal memory type |
DDR3-SDRAM |
Other features
Mac compatibility |
N |
Disk array controller |
LSI 1068 |
Graphics adapter family |
Matrox |
Storage
Hot-swap |
Y |
Hard drive size |
2.5 " |
RAID support |
Y |
Maximum storage capacity |
16 TB |
Number of hard drives supported |
16 |
Total storage capacity |
2600 GB |
Power
Number of power supply units |
2 |
Power supply type |
AC/DC |
Power supply |
675 W |
Networking
LAN controller |
Broadcom BCM5709S |
Wake-on-LAN ready |
Y |
Networking features |
Gigabit Ethernet |
Design
Chassis type |
Rack (2U) |
Optical drive type |
N |
Graphics
Maximum graphics adapter memory |
16 MB |
Ports & interfaces
Serial ports quantity |
1 |
VGA (D-Sub) ports quantity |
2 |
Operational conditions
Operating altitude |
914.4 - 2133 m |
Certificates
Compliance industry standards |
IEEE 802.3, IEEE 802.3u, IEEE 802.3ab |
Energy Star certified |
Y |
Additionally
Ethernet LAN connection |
Y |
System bus data transfer rate |
6.4 GT/s |
Graphics |
G200eV |
Chipset |
Intel 5520 |
InTru™ 3D Technology |
N |
Ethernet LAN (RJ-45) ports quantity |
2 |
Intel AES New Instructions |
Y |
x3650 M3, 2 x Intel Xeon X5650 (12M Cache, 2.66 GHz, 6.40 GT/s Intel QPI), 24GB DDR3, 16 x 2.5" SAS/SATA/SSD HDD, 1 x 500GB HDD, 7 x 300GB HDD, Hot-Swap, 2 x RJ-45, Gigabit Ethernet, 4 x USB 2.0, Rack/2U
Highlights:
- Improve cost-effectiveness with higher performance per watt.
- Simplify management and serviceability with flexible design.
- Manage risk with resilient architectures and virtualized environments.
Packed with innovation
The IBM System x3650 M3 provides outstanding performance for your mission-critical applications. Its energy-efficient design supports more cores, memory and data capacity in a scalable 2U package that’s easy to service and manage. With more computing power per watt and the latest Intel® Xeon® processors, you can reduce costs while maintaining speed and availability.
Simplify management and serviceability
The x3650 M3 offers a flexible, scalable design and simple upgrade path to 16 HDDs or SSDs, and 192 GB of memory. Comprehensive systems management tools such as advanced diagnostics, a cable management arm and the ability to control resources from a single point make it easy to deploy, integrate, service and manage.
Product features
- Power-optimized performance that leverages the speed of new Intel processors with more capacity and memory.
- Innovative, energy-smart 2U design to help lower operational costs.
- Energy-efficient design with UDIMMs, 40 W processing and UEFI BIOS.
- Better serviceability with a highly scalable, flexible design that is easy to deploy, integrate, service and manage.
- Easier risk management with resilient architectures and virtualized environments.
Hardware summary
- 2U chassis.
- Up to two 3.46 GHz six-core (3.60 GHz four-core) Intel Xeon 5600 series processors with QuickPath Interconnect technology, up to 1333 MHz memory access speed.
- Up to 192 GB RDIMMs or 48 GB UDIMMs high-performance, new-generation DDR-3 memory.
- Internal storage flexibility with up to sixteen 2.5" hot-swap SAS/SATA HDDs or SSDs.
- Up to four PCIe slots.
- Low 675 W design and up to 94% efficient power supplies, six cooling fan modules, new UEFI BIOS, altimeter monitored by Integrated Management Module and IBM Systems Director Active Energy Manager™.
- NEBS 1/ETSI equivalent compliance for both AC and DC power supplies (model dependent).
- Compliance with 80-PLUS® and ENERGY STAR® energy-efficiency standards (model dependent).
- VMware ESXi embedded hypervisor support with optional 2 GB USB key for virtualization.