Intel Rapid Storage Technology | N |
---|---|
Graphics & IMC lithography | 45 nm |
Intel Fast Memory Access | N |
Intel Flex Memory Access | N |
Intel® Quick Sync Video Technology | N |
Intel® Insider™ | N |
Intel Hyper-Threading Technology | Y |
Intel® Wireless Display (Intel® WiDi) | N |
Intel® Clear Video HD Technology (Intel® CVT HD) | Y |
Execute Disable Bit | Y |
Thermal Monitoring Technologies | N |
Intel Trusted Execution Technology | N |
Physical Address Extension (PAE) | 36 bit |
Processor package size | 37.5 mm |
Processor ARK ID | 46472 |
Intel 64 | Y |
Intel Clear Video Technology | N |
Intel Dual Display Capable Technology | Y |
CPU configuration (max) | 1 |
Embedded options available | N |
Intel Virtualization Technology for Directed I/O (VT-d) | N |
Intel® Anti-Theft Technology (Intel® AT) | N |
Intel® Turbo Boost Technology | N |
Intel Enhanced Halt State | Y |
Intel® My WiFi Technology (Intel® MWT) | N |
Intel Clear Video Technology for MID | N |
Intel vPro Technology | N |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel FDI Technology | Y |
Enhanced Intel SpeedStep Technology | Y |
Intel Demand Based Switching | N |
Supported instruction sets | SSE4.2 |
On-board graphics adapter | Y |
---|---|
On-board graphics adapter base frequency | 733 MHz |
Number of displays supported (on-board graphics) | 2 |
On-board graphics adapter family | Intel HD Graphics |
Processor cache | 4 MB |
---|---|
Processor lithography | 32 nm |
Bus type | DMI |
Thermal Design Power (TDP) | 73 W |
Maximum number of PCI Express lanes | 16 |
Processor codename | Clarkdale |
Conflict Free processor | N |
PCI Express configurations | 1x16, 2x8 |
Memory bandwidth supported by processor (max) | 21 GB/s |
FSB Parity | N |
CPU multiplier (bus/core ratio) | 22 |
Processor operating modes | 64-bit |
Stepping | C2 |
Processor cores | 2 |
Processor frequency | 2.93 GHz |
Maximum internal memory supported by processor | 16 GB |
Tcase | 72.6 °C |
ECC supported by processor | N |
Processor cache type | Smart Cache |
Number of Processing Die Transistors | 382 M |
PCI Express slots version | 2.0 |
Memory clock speed | 1333 MHz |
---|---|
Memory slots | 2x SO-DIMM |
Internal memory | 2 GB |
Power supply | 130 W |
---|
Graphics adapter family | Intel |
---|
Hard drive capacity | 250 GB |
---|---|
Hard drive interface | Serial ATA, Serial ATA II |
InTru™ 3D Technology | N |
---|---|
Intel AES New Instructions | N |
System bus data transfer rate | 2.5 GT/s |
Processing die size | 81 mm² |
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