Intel Dual Display Capable Technology | N |
---|---|
CPU configuration (max) | 1 |
Intel Rapid Storage Technology | N |
Intel Fast Memory Access | N |
Intel Flex Memory Access | N |
Execute Disable Bit | Y |
Idle States | Y |
Thermal Monitoring Technologies | N |
Intel Trusted Execution Technology | N |
Physical Address Extension (PAE) | 36 bit |
Intel Virtualization Technology (VT-x) | Y |
Processor package size | 42.5 mm |
Processor ARK ID | 39718 |
Processor code | SLBEW |
Intel® Quick Sync Video Technology | N |
Intel® Insider™ | N |
Intel 64 | Y |
Intel Clear Video Technology | N |
Embedded options available | N |
Intel Virtualization Technology for Directed I/O (VT-d) | N |
Intel® Smart Cache | Y |
Intel® Anti-Theft Technology (Intel® AT) | N |
Intel Hyper-Threading Technology | Y |
Intel® Turbo Boost Technology | Y |
Intel Enhanced Halt State | Y |
Intel® My WiFi Technology (Intel® MWT) | N |
Intel Clear Video Technology for MID | N |
Intel vPro Technology | N |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel FDI Technology | N |
Enhanced Intel SpeedStep Technology | Y |
Intel Demand Based Switching | Y |
Intel® Wireless Display (Intel® WiDi) | N |
Intel® Clear Video HD Technology (Intel® CVT HD) | N |
Supported instruction sets | SSE4.2 |
Processor front side bus | 1066 MHz |
---|---|
Number of Processing Die Transistors | 731 M |
Processor core voltage (AC) | 0.800 - 1.225 V |
Processor boost frequency | 2.93 GHz |
Number of QPI links | 1 |
Processor cache | 8 MB |
Processor lithography | 45 nm |
Thermal Design Power (TDP) | 130 W |
Processor codename | Bloomfield |
Memory clock speeds supported by processor | 800, 1066 MHz |
Memory channels supported by processor | Triple |
Conflict Free processor | N |
Memory bandwidth supported by processor (max) | 25.6 GB/s |
Processor cache type | Smart Cache |
FSB Parity | N |
CPU multiplier (bus/core ratio) | 20 |
Processor operating modes | 64-bit |
Processor system type | UP |
Stepping | D0 |
Processor cores | 4 |
Processor frequency | 2.66 GHz |
Maximum internal memory supported by processor | 24 GB |
Tcase | 67.9 °C |
ECC supported by processor | Y |
Memory types supported by processor | DDR3-SDRAM |
Bus type | QPI |
Internal memory type | DDR3-SDRAM |
---|---|
Maximum internal memory | 12 GB |
Internal memory | 6 GB |
Serial ports quantity | 1 |
---|---|
PS/2 ports quantity | 2 |
Firewire (IEEE 1394) ports | 2 |
Headphone outputs | 1 |
Microphone in | Y |
VGA (D-Sub) ports quantity | 1 |
Display included | N |
---|
Hard drive capacity | 500 GB |
---|---|
Card reader integrated | Y |
Hard drive interface | Serial ATA |
Audio system | ADI 1988 A |
---|
Chassis type | Tower |
---|
InTru™ 3D Technology | N |
---|---|
Processing die size | 263 mm² |
System bus data transfer rate | 4.80 GT/s |
Intel AES New Instructions | N |
Ethernet LAN (RJ-45) ports quantity | 1 |
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