Bus type | FSB |
---|---|
Processor core voltage (AC) | 1.25-1.400 V |
Processor cache | 2 MB |
Processor lithography | 90 nm |
Thermal Design Power (TDP) | 95 W |
Conflict Free processor | N |
Processor front side bus | 800 MHz |
Processor cache type | L2 |
FSB Parity | N |
Number of Processing Die Transistors | 230 M |
CPU multiplier (bus/core ratio) | 14 |
Processor operating modes | 64-bit |
Processor cores | 2 |
Processor frequency | 2.8 GHz |
Tcase | 64.1 °C |
ECC supported by processor | N |
Networking features | 10/100 Mb |
---|---|
Expansion slots | 1x PCI Express 16X\n3x PCI\n |
Display included | Y |
---|
Intel Rapid Storage Technology | N |
---|---|
Intel Fast Memory Access | N |
Intel Flex Memory Access | N |
Execute Disable Bit | Y |
Thermal Monitoring Technologies | N |
Intel Trusted Execution Technology | N |
Physical Address Extension (PAE) | 32 bit |
Processor package size | 37.5 mm |
Processor ARK ID | 27512 |
Intel® Quick Sync Video Technology | N |
Intel® Insider™ | N |
Intel 64 | Y |
Intel Clear Video Technology | N |
Intel Dual Display Capable Technology | N |
Embedded options available | N |
Intel Virtualization Technology for Directed I/O (VT-d) | N |
Intel® Anti-Theft Technology (Intel® AT) | N |
Intel Hyper-Threading Technology | N |
Intel® Turbo Boost Technology | N |
Intel Enhanced Halt State | Y |
Intel® My WiFi Technology (Intel® MWT) | N |
Intel Clear Video Technology for MID | N |
Intel vPro Technology | N |
Intel VT-x with Extended Page Tables (EPT) | N |
Intel FDI Technology | N |
Enhanced Intel SpeedStep Technology | N |
Intel Demand Based Switching | N |
Intel® Wireless Display (Intel® WiDi) | N |
Intel® Clear Video HD Technology (Intel® CVT HD) | N |
Discrete graphics adapter model | AMD Radeon Xpress 200 |
---|---|
Maximum graphics adapter memory | 0.256 GB |
Hard drive speed | 7200 RPM |
---|---|
Total storage capacity | 250 GB |
Hard drive interface | Serial ATA |
PS/2 ports quantity | 2 |
---|
Internal memory type | DDR2-SDRAM |
---|---|
Internal memory | 1 GB |
Chassis type | Midi Tower |
---|
InTru™ 3D Technology | N |
---|---|
Processing die size | 206 mm² |
Intel AES New Instructions | N |
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