Scythe Grand Kama Cross 2 Processor Cooler

Scythe Grand Kama Cross 2 Processor Cooler

MPN: SCKC-3000
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Technical specifications

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Performance

Maximum airflow 97.18 cfm
Minimum airflow 37.37 cfm
Airflow 165 m³/h
Minimum air pressure 0.15 mmH2O
Maximum air pressure 1.02 mmH2O
Noise level (low speed) 13 dB
Noise level (high speed) 30.7 dB
Rotational speed (min) 300 RPM
Rotational speed (max) 1300 RPM
Type Cooler
Suitable for Processor
Number of fans 1 fan(s)
Fan diameter 140 mm
Supported processor sockets Socket AM3, Socket AM3+, Socket AM2+, Socket FM2, Socket AM2, Socket FM1
Grand Kama Cross 2 - 140mm, 13-30.7 dBA, 1300 rpm, 760g, Black/Silver The Grand Kama Cross 2 is the consistent development of the Grand Kama Cross CPU cooler. The proven, unique X-structure top-flow design has been kept, the mounting system is now a lot simpler, and more user-friendly. Socket compatibility is guaranteed up to the newest socket 1150 from Intel. The factory-fitted 140 mm GlideStream fan does its job efficiently, and ensures a quiet operation even at maximum rpms, rounding up the harmonic picture of the new Grand Kama Cross 2.

User-friendly InstallationHPMS
The newly developed H.P.M.S. (Hyper Precision Mounting System) installation method fitted to the Grand Kama Cross 2 ensures an easier and faster mounting of the cooler. The heatsink is screwed to the motherboard guaranteeing a solid and safe fit. Even Intel's newest, the LGA1150 soon to be on the market, will be no problem for the new Grand Kama Cross 2.

Top-Blow Fan
The unique "top-blow" design provides effectively cooling to the voltage regulator modules and chipsets, thus extending the life span of those components and motherboard.top_blow

X-Structure Design
The unique design of the Grand Kama Cross 2, in fact the Grand Kama Cross series all the way through, allows mounting memory modules fitted with larger heatsinks without interference. Even large VRM or chipset-heatsinks placed around the CPU-socket will not prevent the user from benefiting from the Grand Kama Cross 2.
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