Spire SP-455/10G heat sink compound

Thermal kit-Pro The new Spire Thermal-Kit Pro is a high performance kit with quality thermal interface material designed to maximize heat transfer from processors to heat-sink enabling you to get better cooling performance and lower CPU and GPU temperatures. The high viscosity formula efficiently fills invisible surface imperfections to improve contact and thermal conductivity. The supplied 10gram syringe is sufficient for up to 25 to30 heat-sink installations.The supplied cleanser fluid removes all thermal interface residues including silver based compounds and prepares the processor surface for new thermal compound application. Ideal to clean CPU’s, GPU’s, Chipsets and RAM modules. The 100ml bottle Cleanser will last for months to come. Furthermore included a spatula-knife which makes it easy to clean any old residue and evenly apply the new Spire thermal grease.