Technical details
| Operating shock |
50 G |
| Operating vibration |
2.17 G |
| Status |
4 |
| Maximum operating altitude |
3048 m |
| Maximum non-operating altitude |
12192 m |
| Sequential writing speed |
1080 MB/s |
| Sequential reading |
2700 MB/s |
| Market segment |
SRV |
| Product brief URL |
http://www.intel.com/content/dam/www/public/us/en/documents/product-briefs/intel-ssd-dc-family-for-pcie-brief.pdf |
| SSD shock |
50 G Trapezoidal, 170 in/s |
| SSD power consumption (active) |
12W (write), 9W (read) |
| SSD power consumption (idle) |
4W |
| SSD interface |
PCIe NVMe 3.0 x4 |
| SSD endurance rating |
7.3 PBW (JEDEC Workload), 10 DWPD |
| SSD weight |
185gm |
| Born on date |
Q2'14 |
| Drive capacity |
400 GB |
| Product name |
Intel SSD DC P3700 Series (400GB, 1/2 Height PCIe 3.0, 20nm, MLC) |
| Non-operating vibration |
3.13 G |
Other features
| Internal |
Y |
| Uncorrectable Bit Error Rate (UBER) |
less than 1 sector per 1e17 bits read |
Performance
| Solid-state drive capacity |
400 GB |
| Lithography |
20 nm |
| Read speed |
2700 MB/s |
| Write speed |
1080 MB/s |
| ECC |
Y |
| Wi-Fi |
N |
| Random write (100% span) |
75000 IOPS |
| Random read (100% span) |
450000 IOPS |
| Memory type |
MLC |
| Intel High Endurance Technology (HET) |
Y |
| Sequential writing |
Y |
| PCI Express interface data lanes |
x4 |
| Random write (4KB) |
75000 IOPS |
| Random read (4KB) |
450000 IOPS |
| Latency (read) |
20 µs |
| Latency (write) |
20 µs |
| Enhanced Power Loss Data Protection technology |
Y |
| SSD temperature monitoring |
Y |
| Endurance rating (for 5 years) |
0.3 GB/day |
| End-to-End Data Protection |
Y |
| Random read (8KB) |
275000 IOPS |
| Random write (8KB) |
32000 IOPS |
| Solid-state drive interface |
PCI Express |
Power
| Power consumption (idle) |
4 W |
| Power consumption (read) |
9 W |
| Power consumption (write) |
12 W |
Design
| SSD form factor |
PCI Experess |
| Product family |
Data center SSD |
| Product series |
Intel DC P3700 |
| Product codename |
Fultondale |
400GB, NAND 20nm MLC, PCIe NVMe 3.0 x4, 2700 MB/s, 1080 MB/s, CEM2.0.
NVMe (Non-Volatile Memory Express) is a scalable, high performance CPU PCI-E Gen3 direct connnect to NVMe devices, designed for Client and Enterprise server systems using SSDs technology, that was developed to reduce latency and provide faster CPU to data storage device performance.
By deploying Supermicro NVMe, customers can benefit from reduced latency, increased Input/Output operations per second (IOPS), and lower power consumption. This means that customers' Supermicro solutions can perform more work in less time, translating into lower costs and increased revenues. Thus the ROI benefits for customers from NVMe enabled Supermicro servers is immediate and substantial.
The Supermicro server solutions with NVMe support are targeted at HPC, Oil and Gas, 3D modeling and Graphical design workstation, HFT, SQL Database, Search Engine, High Security Encryption datacenter, VDI, Aerospace and Automobile design center, Cluster and Supercomputer applications; in Cloud, Virtualization, and Enterprise environments.
- Large throughput gains (6x)
- Substantial latency improvements (7x)
- Shared common backplane improves flexibility of drive choice
- Improved serviceability vs. PCI-E Flash cards (hot-swap)
- Improved power efficiency
