Memory
Supported memory clock speeds |
1600, 1866, 2133 MHz |
Number of DIMM slots |
16 |
Supported memory types |
DDR4-SDRAM |
Supported RDIMM module capacity |
16GB, 32GB, 4GB, 8GB |
Memory voltage |
1.2 V |
Supported LRDIMM module capacity |
32GB, 64GB |
Maximum internal memory |
1000 GB |
BIOS
BIOS type |
AMI |
BIOS memory size |
128 MB |
ACPI version |
4.0 |
Design
Motherboard form factor |
Extended ATX |
Component for |
Server |
Processor
Thermal power |
160 W |
Number of processors supported |
2 |
Intel Xeon series |
E5-2600 |
Supported QPI |
9.6 GT/s |
Processor manufacturer |
Intel |
Processor number of cores supported |
18 |
Internal I/O
TPM connector |
Y |
Number of SATA III connectors |
10 |
Expansion slots
PCI Express x8 (Gen 3.x) slots |
2 |
PCI Express x16 (Gen 3.x) slots |
3 |
PCI Express x4 (Gen 2.x) slots |
1 |
Performance
Audio output channels |
7.1 channels |
Networking
LAN controller |
Intel I210 |
Ethernet interface type |
Gigabit Ethernet |
Wi-Fi |
N |
Wi-Fi standards |
Not supported |
Back panel I/O ports
USB 3.0 (3.1 Gen 1) Type-A ports quantity |
6 |
Storage controllers
Hard drive interface |
Serial ATA III |
Additionally
Chipset |
Intel C612 |
Ethernet LAN connection |
Y |
Ethernet LAN (RJ-45) ports quantity |
2 |
Dual socket R3, LGA 2011, Intel Xeon E5-2600 v3, QPI up to 9.6GT/s, Intel C612, 1TB ECC DDR4 2133MHz, 16x DIMM, 7.1 HD Audio, Retail Pack
Introducing Supermicro's latest generation of dual processor motherboard technology based on Intel's E5-2600 v3 Haswell processor. Supermicro's X10 motherboards are specifically designed to meet the demanding needs of today's complex computational workloads. Feature rich and highly expandable, our X10 motherboards provide the latest advanced integrated and expandable storage and networking technologies. Features like lightning fast DDR4 memory, NVMe/SAS3/SATA3 storage interfaces, 1G/10GBASE-T, 10G SFP+, 40GbE, and Infiniband QDR/FDR. With its unprecedented set of features, each X10 motherboard is specifically tailored to provide optimal performance while helping to reduce deployment and operational costs over the lifespan of the product.