Memory
| Supported memory clock speeds |
1600, 1866, 2133 MHz |
| ECC |
Y |
| Supported RDIMM module capacity |
16GB, 32GB, 4GB, 8GB |
| Supported LRDIMM module capacity |
64GB, 32GB |
| Number of DIMM slots |
16 |
| Supported memory types |
DDR4-SDRAM |
| Memory voltage |
1.2 V |
Processor
| Intel Xeon series |
E5-2600 |
| Supported QPI |
9.6 GT/s |
| Processor manufacturer |
Intel |
| Processor number of cores supported |
18 |
| Thermal power |
145 W |
| Number of processors supported |
2 |
Back panel I/O ports
| IPMI LAN (RJ-45) port |
Y |
| USB 3.0 (3.1 Gen 1) Type-A ports quantity |
3 |
| VGA (D-Sub) ports quantity |
1 |
| Serial ports quantity |
1 |
Networking
| LAN controller |
Intel I350, Realtek RTL8211E |
| Ethernet interface type |
Gigabit Ethernet |
| Wi-Fi |
N |
| Wake-on-LAN ready |
Y |
Internal I/O
| Number of SATA III connectors |
10 |
| TPM connector |
Y |
BIOS
| ACPI version |
4.0 |
| BIOS type |
AMI |
| BIOS memory size |
128 MB |
Storage controllers
| Hard drive interface |
Serial ATA III |
Expansion slots
| PCI Express x8 (Gen 3.x) slots |
2 |
Additionally
| Chipset |
Intel C612 |
| Ethernet LAN connection |
Y |
| Ethernet LAN (RJ-45) ports quantity |
3 |
Dual socket R3, LGA 2011, Intel Xeon E5-2600 v3, Intel C612 Express chipset, Up to 1TB ECC DDR4 2133MHz, 16x DIMM, Intel i350 Dual port Gigabit Ethernet, 10x SATA3, 3x USB 3.0, 4x USB 2.0, Retail Pack
Introducing Supermicro's latest generation of dual processor motherboard technology based on Intel's E5-2600 v3 Haswell processor. Supermicro's X10 motherboards are specifically designed to meet the demanding needs of today's complex computational workloads. Feature rich and highly expandable, our X10 motherboards provide the latest advanced integrated and expandable storage and networking technologies. Features like lightning fast DDR4 memory, NVMe/SAS3/SATA3 storage interfaces, 1G/10GBASE-T, 10G SFP+, 40GbE, and Infiniband QDR/FDR. With its unprecedented set of features, each X10 motherboard is specifically tailored to provide optimal performance while helping to reduce deployment and operational costs over the lifespan of the product.
