Supermicro X9SPV-M4-3QE Intel QM77 Express BGA1023 Mini ITX motherboard

Supermicro X9SPV-M4-3QE Intel QM77 Express BGA1023 Mini ITX motherboard

MPN: MBD-X9SPV-M4-3QE-O
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Germany
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Technical specifications

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Performance

Motherboard form factor Mini ITX
Trusted Platform Module (TPM) version 1.2
Motherboard chipset family Intel
Trusted Platform Module (TPM) Y
PC health monitoring FAN, LED, Temperature, Voltage
Audio system HD

Memory

Supported memory clock speeds 1333, 1600 MHz
ECC Y
Unbuffered memory Y
Supported memory types DDR3-SDRAM
Memory voltage 1.35, 1.5 V
Memory channels Dual
Memory slots type SO-DIMM
Supported memory module capacities 2GB, 4GB, 8GB
Number of memory slots 2
Maximum internal memory 16 GB

BIOS

BIOS memory size 128 MB
BIOS type AMI
ACPI version 2.0

Internal I/O

USB 2.0 connectors 6
USB 3.0 (3.1 Gen 1) connectors 2
Number of SATA III connectors 2
Number of SATA II connectors 4
Number of COM connectors 1

Graphics

Graphics adapter family Intel

Expansion slots

PCI Express x16 (Gen 3.x) slots 1

Processor

Processor thermal power (max) 35 W
Processor cores 4
Processor frequency 2.1 GHz
Intel Core i3/i5/i7 series i7-3xxx

Back panel I/O ports

DVI-I ports quantity 1
DisplayPorts quantity 1
USB 3.0 (3.1 Gen 1) Type-A ports quantity 2
HDMI ports quantity 1

Networking

Wi-Fi N

Additionally

Chipset Intel QM77 Express
Graphics HD Graphics 4000
System bus data transfer rate 5 GT/s
Ethernet LAN connection Y
Ethernet LAN (RJ-45) ports quantity 4
Intel Core i7-3612QE, Intel QM77, Up to 16GB ECC DDR3, 1600/1333MHz, 2x SO-DIMMs, Graphics HD 4000, AMT 8.0, vPro, TPM 1.2 header, Retail Pack Supermicro X9SPV-F and X9SPV-LN4F motherboards based on the Mobile Intel QM77 Express chipset support Intel's 3rd Generation Core i7/i5/i3 processors. The compact mini-ITX motherboards are ideal for high-performance, low-power embedded applications, with features that include support for 16GB DDR3 Memory, SATA 3 & SATA 2 HDD/SSD storage with RAID support, 4x Gigabit Ethernet LAN Ports, PCI-E 3.0 x16 slot for added Graphics, Networking or I/O expansion. Compared to the previous generation architecture, this solution delivers 15% more processing performance, up to 50% more 3D graphics performance supporting the latest graphic APIs - DX11, OpenCL 1.1 and OpenGL 3.1 and new features such as Intel® Smart Response Technology enabling increased storage I/O performance with SSD caching.
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