Memory
| Supported memory types |
DDR3-SDRAM |
| Supported RDIMM module capacity |
8GB, 4GB, 2GB |
| Memory slots type |
SO-DIMM |
| Memory voltage |
1.5, 1.35 V |
| ECC |
Y |
| Internal memory |
16 GB |
BIOS
| BIOS memory size |
128 MB |
| BIOS type |
AMI |
Back panel I/O ports
| DisplayPorts quantity |
1 |
| HDMI ports quantity |
1 |
| DVI-I ports quantity |
1 |
| USB 3.0 (3.1 Gen 1) Type-A ports quantity |
4 |
Internal I/O
| Number of COM connectors |
1 |
Expansion slots
| PCI Express x16 (Gen 3.x) slots |
1 |
Performance
| Motherboard chipset family |
Intel |
Networking
| Wake-on-LAN ready |
Y |
| Wi-Fi |
N |
Processor
| Intel Core i3/i5/i7 series |
i7-3xxx |
Additionally
| Chipset |
Intel QM77 Express |
| Ethernet LAN (RJ-45) ports quantity |
4 |
| Ethernet LAN connection |
Y |
Embedded 3rd Generation Intel Core i7-3555LE Mobile ECC, Intel QM77, 16GB ECC DDR3 1600/1333MHz, 2x SO-DIMMs, Intel Integrated Graphics HD 4000, Retail Pack
<b>QM77 Express chipset / Socket FCBGA1023 Boards</b>
Supermicro X9SPV-F and X9SPV-LN4F motherboards based on the Mobile Intel QM77 Express chipset support Intel's 3rd Generation Core i7/i5/i3 processors. The compact mini-ITX motherboards are ideal for high-performance, low-power embedded applications, with features that include support for 16GB DDR3 Memory, SATA 3 & SATA 2 HDD/SSD storage with RAID support, 4x Gigabit Ethernet LAN Ports, PCI-E 3.0 x16 slot for added Graphics, Networking or I/O expansion. Compared to the previous generation architecture, this solution delivers 15% more processing performance, up to 50% more 3D graphics performance supporting the latest graphic APIs - DX11, OpenCL 1.1 and OpenGL 3.1 and new features such as Intel® Smart Response Technology enabling increased storage I/O performance with SSD caching.
