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Technical specifications
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Technical details
Diameter
0.8 mm
Chemical composition
60% Sn - 40% Pb
Melting point
185 °C
Solder type
Lead
Lead-Free Solder Sn 99.3% - Cu 0.7% 0.8mm 500g
- weight: 500g - Ø: 0.8mm - 99.3% SN - 0.7% Cu - with resin core - melting point: 230°C
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