Asrock H55M-LE Socket H (LGA 1156) Micro ATX motherboard

Asrock H55M-LE Socket H (LGA 1156) Micro ATX motherboard

MPN: H55M-LE
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Germany
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Technical specifications

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Performance

Motherboard form factor Micro ATX
Audio system VIA VT1718S

BIOS

BIOS memory size 16 MB

Internal I/O

USB 2.0 connectors 2
Number of SATA connectors 4
ATX Power connector (24-pin) Y
Power fan connector Y
CPU fan connector Y
Number of COM connectors 1
Chassis intrusion connector Y
Front panel audio connector Y

Graphics

Maximum graphics adapter memory 1759 MB
On-board graphics adapter Y

Memory

Non-ECC Y
Number of memory slots 2
Maximum internal memory 8 GB

Back panel I/O ports

DVI-D ports quantity 1
PS/2 ports quantity 1
VGA (D-Sub) ports quantity 1

Expansion slots

PCI slots 2
PCI Express x16 slots 1
PCI Express x1 slots 1

Packaging content

Drivers included Y

Networking

Networking features 10/100/1000 Mbps

Additionally

Ethernet LAN (RJ-45) ports quantity 1
H55M-LE - 1156, DD3, Intel H55, micro ATX, Ethernet - Supports the Intel Core i7 / i5 / i3 and Pentium G6950 Processors in the LGA1156 Package
- Solid Capacitor for CPU power
- Supports Intel Turbo Boost Technology
- Intel H55 Chipset
- Supports Dual Channel DDR3 2600+(OC)/2133(OC)/1866(OC)/1600/1333/1066 non-ECC, un-buffered memory, 2 x DIMM slots, Max. capacity up to 8GB

EuP / ErP Reday

EuP / ErP, stands for Energy Using Product, was a provision regulated by European Union to define the power consumption for the completed system. According to EuP / ErP, the total AC power of the completed system shall be under 1.00W in off mode condition. To meet EuP / ErP standard, the EuP / ErP ready motherboard and the EuP / ErP ready power supply are required. (The EuP / ErP ready power supply must meet the standard of 5v standby power efficiency is higher than 50% under 100 mA current consumption).
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