Processor special features
| Intel VT-x with Extended Page Tables (EPT) |
Y |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
N |
| Intel Hyper-Threading Technology |
N |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
N |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
35433 |
| Intel Virtualization Technology (VT-x) |
Y |
| Intel Trusted Execution Technology |
N |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel® Turbo Boost Technology |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
| Intel Demand Based Switching |
N |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
Storage
| Hard drive interface |
Serial Attached SCSI (SAS) |
| Hot-swap |
Y |
Processor
| Processor frequency |
3 GHz |
| Stepping |
E0 |
| Processor cores |
4 |
| Processor operating modes |
64-bit |
| Embedded options available |
N |
| FSB Parity |
N |
| Number of Processing Die Transistors |
820 M |
| Processor front side bus |
1333 MHz |
| Conflict Free processor |
N |
| Processor cache type |
L2 |
| Processor codename |
Yorkfield |
| Processor code |
SLB8Z |
| Thermal Monitoring Technologies |
N |
| Thermal Design Power (TDP) |
95 W |
| Idle States |
N |
| Execute Disable Bit |
Y |
| Processor cache |
12 MB |
| CPU multiplier (bus/core ratio) |
9 |
| Processor lithography |
45 nm |
| Processor package size |
37.5 mm |
| Number of processors installed |
1 |
| Maximum number of SMP processors |
1 |
| Bus type |
FSB |
| ECC supported by processor |
N |
| Tcase |
71.4 °C |
Memory
| Maximum internal memory |
8 GB |
| Internal memory |
2 GB |
| Memory slots |
4 DIMM |
| Memory clock speed |
800 MHz |
| ECC |
Y |
| Internal memory type |
DDR2-SDRAM |
Design
| Optical drive type |
DVD-ROM |
| Chassis type |
Tower (5U) |
Power
| Number of power supply units |
2 |
| Power supply |
430 W |
Graphics
| Maximum graphics adapter memory |
16 MB |
Ports & interfaces
| Parallel ports quantity |
1 |
| Serial ports quantity |
2 |
| VGA (D-Sub) ports quantity |
1 |
Networking
| Networking features |
Gigabit Ethernet |
Additionally
| Processing die size |
214 mm² |
| InTru™ 3D Technology |
N |
| Ethernet LAN (RJ-45) ports quantity |
1 |
| Intel AES New Instructions |
N |
| Graphics |
ES1000 |
1x Quad-Core Intel Xeon X3370 3.0GHz/1333MHz (12MB L2), 2x 1GB PC2-6400 CL6 ECC DDR2 800MHz DIMM, 0x 0 GB hot-swap SFF SAS hard drive (open bay), DVD-ROM, Broadcom 5722 Gigabit Ethernet, ATI ES1000 (RN50) 16MB, 2x 430W
- Manage growth and risk with new technologies that deliver configuration flexibility, data protection and application performance
- Manage complexity with advanced monitoring capabilities that include integrated and remote management options
- Standard scalability and reliability features deliver high levels of system availability—at a value price
The IBM System x3200 M2 is an affordable, single-socket tower server that offers more performance, configuration flexibility and availability features than many other servers in its class. From network infrastructure to distributed applications to front-end workloads, the x3200 M2 is designed to meet a wide range of business needs—and help you adapt to changing business requirements.
