Processor special features
| Intel Hyper-Threading Technology |
Y |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
N |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
27284 |
| Intel Trusted Execution Technology |
N |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Turbo Boost Technology |
N |
| Intel Enhanced Halt State |
Y |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
| Intel Demand Based Switching |
N |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
N |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
Processor
| Embedded options available |
N |
| Number of Processing Die Transistors |
1328 M |
| Processor front side bus |
667 MHz |
| Conflict Free processor |
N |
| Processor cache type |
L2 |
| Thermal Design Power (TDP) |
95 W |
| Processor package size |
53.3 mm |
| Thermal Monitoring Technologies |
N |
| Execute Disable Bit |
Y |
| Processor cache |
4 MB |
| Number of processors installed |
2 |
| Processor cores |
2 |
| Maximum number of SMP processors |
4 |
| CPU multiplier (bus/core ratio) |
18 |
| Processor lithography |
65 nm |
| Processor operating modes |
64-bit |
| FSB Parity |
Y |
| Bus type |
FSB |
| ECC supported by processor |
N |
| Tcase |
60 °C |
| Processor frequency |
3 GHz |
Memory
| ECC |
Y |
| Internal memory |
2 GB |
| Internal memory type |
DDR2-SDRAM |
| Maximum internal memory |
64 GB |
| Memory slots |
16 DIMM |
Graphics
| Maximum graphics adapter memory |
16 MB |
Design
| Chassis type |
Rack (3U) |
| Optical drive type |
DVD-ROM |
Ports & interfaces
| Serial ports quantity |
2 |
| VGA (D-Sub) ports quantity |
1 |
| PS/2 ports quantity |
2 |
Networking
| Networking features |
Gigabit Ethernet |
Storage
| Total storage capacity |
440.4 GB |
Additionally
| InTru™ 3D Technology |
N |
| Ethernet LAN (RJ-45) ports quantity |
2 |
| Processing die size |
435 mm² |
| Intel AES New Instructions |
N |
| Graphics |
Radeon 7000M |
System x3850, 1x Xeon 7120N (3.00 GHz/667 MHz, 2x 1 MB L2 cache/core, 4 MB L3 Cache), 2 x 1 GB PC2-3200 DDR2 ECC Memory, 0 GB SAS HD (open bay), BMC, RSA II, 2x Broadcom 5704 Gigabit Ethernet, SVGA (16MB), 1x 1300 W
- Delivers breakthrough, four-processor performance with 64-bit memory addressability through IBM X3 Architecture, the third-generation of IBM Enterprise X-Architecture™
- Supports high-performance, dual-core 64-bit Intel® Xeon® Processors MP and runs 32- and 64-bit applications simultaneously, providing headroom and investment protection
- High-availability features such as three levels of memory protection and optional advanced systems management help provide high reliability
- Supports new PCI-Express I/O technology while maintaining legacy PCI-X 2.0 compatibility
The IBM System x3850 delivers outstanding performance, extremely low latency and high availability and manageability along with advanced, integrated technologies that help protect your IT investment. The x3850 is designed with IBM X3 Architecture, the third generation of mainframe-inspired IBM Enterprise X-Architecture Technology, and 64-bit Intel Xeon Processors MP. Driving mission-critical applications including Enterprise Resource Planning, database serving or custom-developed, Java™ technology-based applications like IBM WebSphere® software, the x3850 excels at performing transaction-intensive, back-office functions.
