Processor special features
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
N |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
Y |
| Intel Hyper-Threading Technology |
N |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
N |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
29767 |
| Intel Trusted Execution Technology |
N |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Turbo Boost Technology |
N |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
| Intel Demand Based Switching |
N |
Processor
| Processor frequency |
1.86 GHz |
| Stepping |
B3 |
| Processor operating modes |
64-bit |
| Embedded options available |
N |
| FSB Parity |
Y |
| Number of Processing Die Transistors |
582 M |
| Processor front side bus |
1066 MHz |
| Conflict Free processor |
N |
| Processor cache type |
L2 |
| Thermal Monitoring Technologies |
Y |
| Execute Disable Bit |
Y |
| Processor cache |
8 MB |
| Processor cores |
4 |
| Thermal Design Power (TDP) |
50 W |
| CPU multiplier (bus/core ratio) |
7 |
| Processor lithography |
65 nm |
| Processor package size |
37.5 mm |
| Number of processors installed |
1 |
| Maximum number of SMP processors |
2 |
| Bus type |
FSB |
| ECC supported by processor |
N |
| Tcase |
60 °C |
Storage
| Total storage capacity |
292 GB |
Memory
| Maximum internal memory |
32 GB |
| Memory slots |
8 DIMM |
| Internal memory |
2 GB |
| ECC |
Y |
| Internal memory type |
DDR2-SDRAM |
Graphics
| Maximum graphics adapter memory |
16 MB |
Networking
| Networking features |
Gigabit Ethernet |
Additionally
| Graphics |
ES1000 |
| Processing die size |
286 mm² |
| InTru™ 3D Technology |
N |
| Intel AES New Instructions |
N |
BladeCenter HS21, 1x Quad-Core Xeon L5320 1.86 GHz/1066 MHz (8 MB L2 cache), 2x 1 GB PC2-5300 ECC Chipkill DDR2 FBDIMM, 0x SAS HD (open bay), Dual Broadcom 5708S Gigabit Ethernet, Management processor, ATI ES1000 (RN50) 16 MB
- Fast, easy installation and maintenance to help protect your IT investment
- Integrates well into any chassis for enhanced flexibility
- Helps reduce power and cooling costs without sacrificing performance
A flexible, integrated solution
Organizations need reliable servers that offer consistent performance with minimal maintenance. IBM BladeCenter® HS21 is simple to install and maintain, integrates into all BladeCenter chassis at power-efficient envelopes and offers key features for fewer maintenance hassles, such as:
- Predictive Failure Analysis®, light path diagnostics and an integrated System Management Processor for more accurate problem-solving.
- Remote management from a single graphical console with IBM Director for automated tasks.
